‘플립칩 패키징’ 키워드 기사 2 articles
Facing High-Current Power Supply Design Limits, 'GaN Integration' Solution Rapidly Emerging
GaN-based integrated power conversion technology is emerging as a key solution, replacing silicon limitations in high-current environments such as AI …
2026.09.15 by 배종인 기자
[e4ds Tech Day 2026 ①] MPS Director Lee Jun-ho, "Power Semiconductors Will Determine Automotive Performance in the Age of AI Autonomous Driving"
Director Jun-ho Lee of Monolithic Power Systems (MPS) presented on the theme "Power Architecture and the Future of Power Conversion for the SDV Era" a…
2026.09.15 by 배종인 기자