Ministry of Trade, Industry and Energy, Establishment of 400 Billion Won R&D Fund… R&D is a Must for Securing Game Changer Technologies
The Industrial Technology R&D Grand Exhibition was held on the 27th at COEX in Samseong-dong, Seoul, hosted by the Ministry of Industry and Trade. Und…
2024.11.27 by 권신혁 기자
“'Hybrid Bonding' is the Trend, Particle Management is Key”
"Packaging technology is shifting from post-process to pre-process. The paradigm has changed. Accordingly, semiconductor equipment and materials compa…
2024.02.26 by 권신혁 기자
Applied, Hybrid Bonding·TSV New Technology Launched… Heterojunction Chip PPACt Improvement
Heterogeneous Integration (HI) is an advanced solution that increases performance and density while reducing costs. As semiconductor manufacturing app…
2023.07.18 by 명세환 기자
“Advanced Packaging, Transformation of Technology-Intensive Industry”
As advanced packaging technology becomes increasingly important for implementing advanced semiconductors, an event where visitors could explore the la…
2023.04.05 by 명세환 기자
[SEMICON Korea 2023] “Hybrid Bonding, Hot Interest”… Global Small Business Capabilities Focused
"Die to Wafer Hybrid Bonding (D2W bonding) has been under technical development for a long time, but scaling is just beginning now."
2023.02.08 by 명세환 기자
Applied Materials Accelerates Heterogeneous Convergence in the Semiconductor Industry
Applied Materials improves both solution delivery speed and PPACt (power, performance, area, cost, time-to-market) by collaborating with leading compa…
2021.09.16 by 배종인 기자