전체기사9,076건
Memory semiconductor integration will increase 1,000 times compared to now
Professor Lee Jun-hee's research team at UNIST has presented a principle that can increase the integration density of memory semiconductors by more th…
2020.07.03 by 이수민 기자
Byco Joins GSA, Focusing on Development of Automotive Power Modules
Baico has become a member of the Global Semiconductor Alliance (GSA). The GSA is an alliance dedicated to building an efficient, profitable, and susta…
2020.07.03 by 이수민 기자
SK Hynix Begins Mass Production of Next-Generation Memory "HBM2E"
SK Hynix has begun full-scale mass production of HBM2E. This is faster than Samsung Electronics, which announced mass production within this year, as …
2020.07.03 by 강정규 기자
Infineon Debuts Technology to Protect IGBTs from Hydrogen Sulfide
Infineon has announced hydrogen sulfide protection technology that extends the lifespan of IGBT modules operating in harsh environments where hydrogen…
2020.07.03 by 명세환 기자
TI Unveils Two Battery Charger ICs to Simplify Power Adapters
Texas Instruments' BQ25790 and BQ25792 buck-boost battery charger ICs deliver maximum charging current of 5A across the full input voltage range (3.6V…
2020.07.02 by 이수민 기자
Murata Corporation Develops 1.0μF Ceramic Capacitance Capacitance
Murata Manufacturing has developed a multilayer ceramic capacitor with a capacitance of 1.0 μF. The dimensions are 0.4×0.2 mm, which are widely used i…
2020.06.30 by 강정규 기자
Vicor Unveils Two Buck Regulators with Expanded Operating Temperature Range
Vicor has released two types of ZVS buck regulators. The PI3323 and PI3325 ZVS buck regulators feature an expanded operating temperature range of -55~…
2020.06.30 by 강정규 기자
What IoT Devices Need to Prepare for the Post-Corona Era
The world before COVID-19 will not return. Non-contact and remote-based IoT devices will continue to be necessary as long as humanity exists. To devel…
2020.06.30 by 이수민 기자
Toshiba Launches Two 2.2V High-Speed Communication Photocouplers
Toshiba Electronic Devices and Storage Corporation has announced the TLP2312 and TLP2372, high-speed communication photocouplers that can operate in p…
2020.06.30 by 이수민 기자
Microchip Announces Two Automotive Ultra-Small Touch Controllers
Microchip announced the MXT288UD-AM and MXT144UD-AM touch controllers. The two devices provide low-power mode, weather-resistant operation, and gloved…
2020.06.30 by 명세환 기자
"High-efficiency inverters should adopt SiC MOSFETs instead of IGBTs"
As power consumption increases, demand for safe and efficient compact inverters is growing. Accordingly, inverter developers are reviewing power devic…
2020.06.29 by 이수민 기자
Three Korean design houses added to Arm's list of authorized design partners.
Arm announced that it has newly selected three domestic design houses in its Arm Certified Design Partner Program. With this addition, the number of d…
2020.06.29 by 이수민 기자
Infineon Launches BMS Sensing and Balancing IC for EV Batteries
Infineon announced the launch of TLE9012AQU, a sensing and balancing IC for battery management systems in electric vehicles and other applications. Th…
2020.06.26 by 명세환 기자
Wiring spacing within semiconductor devices can be further reduced
A research team led by Professor Shin Hyun-seok at UNIST has successfully developed an ultra-low dielectric constant insulator that enables more preci…
2020.06.25 by 이수민 기자
Vicor Unveils 6U VITA-62 Compatible Power Supply
Vicor announced on the 24th the launch of a VITA 62 compatible power supply. The unit utilizes Vicor's high-density, high-efficiency ChiP power module…
2020.06.24 by 명세환 기자

