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[2025 e4ds Tech Day] Taejun Park, MDS Tech's Deputy Manager, "Providing an Easy-to-Use Environment for 'On-Device AI Development' Even Beginners Can Understand"
AI is now evolving into a technology that performs real-time inference on embedded devices rather than in the cloud. In this context, on-device AI fac…
2025.08.12 by 배종인 기자
ADI: "Integrated On/Off Controller Increases Energy Efficiency and Enhances System Reliability"
Analog Devices, Inc. product application engineer Bryan Angelo Borres and product application manager Noel Tenorio discuss integrated on/off controlle…
2025.08.12 by 배종인 기자
AMD Brings Data Center-Grade AI Models to Consumer PCs
AMD has announced a hardware platform that immediately supports GPT-OSS 20B and 120B, the first open-weight language models disclosed by OpenAI. This …
2025.08.08 by 배종인 기자
AMD ROCm Maximizes AI Performance on Windows
AMD has presented a new application method to maximize GPU performance. Specifically, this involves installing ROCm (AMD's GPU computing platform) usi…
2025.08.08 by 배종인 기자
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Merck will lead new business opportunities by combining its optical capabilities and semiconductor expertise.
We met with Kim Woo-kyou, CEO of Merck KGaA Korea, and Yoon Yong-guk, Head of Merck Optronic Solutions Korea Business Division, at the '2025 Korea Dis…
2025.08.08 by 배종인 기자
Merck to Play a Key Role in Next-Generation OLED and Digital Optics Materials
Global materials company Merck unveiled advanced material technologies related to OLED, digital optics, photoresists, liquid crystals, and sustainabil…
2025.08.07 by 명세환 기자
Rewriting the MCU Concept: The Evolution of Infineon's PSoC™ 4100T Plus
Infineon's PSoC™ 4100T Plus is a true 'all-in-one MCU' that integrates multi-sensing capabilities—capacitive touch, inductive sensing, and liquid leve…
2025.08.07 by 명세환 기자
SanDisk Unveils UltraQLC™ Platform for the AI Era, Unveiling Ultra-High-Capacity 256TB NVMe SSD
Global flash storage leader SanDisk unveiled a 256TB NVMe™ SSD based on its next-generation UltraQLC™ platform at the 'Flash Memory Summit (FMS) 2025'…
2025.08.06 by 배종인 기자
Microchip Launches Adaptec® SmartRAID 4300, a High-Performance NVMe® RAID Storage Solution
Microchip Technology has launched the Adaptec® SmartRAID 4300, its latest NVMe® RAID storage accelerator product line, introducing a high-performance …
2025.08.06 by 명세환 기자
Merck to Unveil AI-Based Materials Solutions for Future Visual Technologies at K-Display 2025
Leading science and technology company Merck will participate in 'K-Display,' South Korea's largest display exhibition held at Seoul COEX from August …
2025.08.06 by 배종인 기자
Nubicom Maximizes Developer Test Generation with AI Tools
Nubicom, Korea's leading electronic measurement instrument distributor and the official distributor of NI (National Instruments), has begun domestic s…
2025.08.05 by 명세환 기자
ACM Dramatically Improves Wet Etching Uniformity and Cleaning Performance
ACM Research, Inc., a global leader in semiconductor and advanced wafer-level packaging (WLP) process solutions, has achieved breakthrough improvement…
2025.08.05 by 배종인 기자
"Communication errors between different grounding and voltage domains solved with a single chip."
As low-voltage modular systems become increasingly prevalent, the risk of communication errors between different ground and voltage domains has risen.…
2025.08.05 by 배종인 기자
NPU-equipped MCU shipments to reach approximately 1.8 billion units by 2030, offering new possibilities for industrial applications.
According to a white paper recently released by STMicroelectronics (ST) titled "Innovation in Edge AI: The Power of Neural Processing Units Delivered …
2025.08.05 by 배종인 기자
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Etiphos secures $17 million in Series B funding, marking the company's leap forward as a global fabless semiconductor company.
ETTIFOS (CEO Kim Ho-jun), a communication modem semiconductor specialist leading next-generation Intelligent Transportation Systems (C-ITS) and fully …
2025.08.01 by 배종인 기자