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AMD Epic Processor, Nokia Cloud Platform Introduced
AMD EPYC processors are being deployed in Nokia's cloud platform, simultaneously enhancing both performance and energy efficiency in next-generation 5…
2025.06.11 by 명세환 기자
OpenGMSL™ Association Launches, Revolutionizing the Future of In-Vehicle Connectivity
Analog Devices, Inc. (ADI)'s road-validated Gigabit Multimedia Serial Link (GMSL™) forms the core of the newly launched OpenGMSL Alliance, which aims …
2025.06.10 by 배종인 기자
“BAW Clock Opens Smart Autonomous Driving with Technological Advantage”
We explored BAW (Bulk Acoustic Wave) clocks, which are set to replace conventional quartz oscillators in clocking technology that synchronizes various…
2025.06.10 by 명세환 기자
SK Hynix Breaks Through Limits with 4F² VG Platform and 3D DRAM
SK Hynix CTO Chan-Yong Cha, Head of Future Technology Research Institute (with CEO Noh-Jung Gwak), officially announced the next-generation DRAM techn…
2025.06.10 by 배종인 기자
A step forward in the industrialization of thermoelectric power generation, establishing procedures from evaluation criteria to verification
Utilizing the only domestic testbed that realistically reproduces high-temperature exhaust gas environments in industrial fields, Dr. Park Su-dong's t…
2025.06.09 by 명세환 기자
Byco opens the door to mid-level vehicle applications with ultra-compact active suspension power module
Vicor, a provider of innovative high-density power modules, is supplying its fixed-ratio DC-DC converter module (BCM6135), which converts 800V high vo…
2025.06.09 by 배종인 기자
In the era of WBG semiconductors, power device testing also evolves into ‘dynamic’
The adoption of SiC and GaN-based wide bandgap semiconductors has presented limitations in conventional static testing. NI has become the first in the…
2025.06.09 by 명세환 기자
Qualcomm V2X Chipset Single Supply System Strengthened, 'Etiforce' Alternative Supplier Emerges Rapidly
U.S. semiconductor company Qualcomm has acquired Israeli V2X (vehicle-to-infrastructure communication) specialist fabless AutoTalks for approximately …
2025.06.09 by 배종인 기자
Maximizing Vector, Embedded Developer Productivity
Vector Korea (Branch Manager Jang Ji-hwan), a global company in the field of vehicle networking and embedded systems development, has officially annou…
2025.06.05 by 명세환 기자
AMD SVP Salil Raj: “From Birth to AI Acceleration: Celebrating 40 Years of FPGA Innovation”
Celebrating FPGA's 40th anniversary, Salili Raje, AMD Senior Vice President and General Manager of Adaptive and Embedded Computing Group (AECG), discu…
2025.06.04 by 명세환 기자
ST Strengthens Piezoelectric MEMS Technology Through Global Collaboration
Global semiconductor company STMicroelectronics (hereinafter ST) has launched efforts to strengthen piezoelectric MEMS technology through global colla…
2025.06.04 by 배종인 기자
[Technical contribution] ADI Adam Huff and George Chian, Measuring loop response when upper feedback resistor is not accessible
Adam Huff and George Chian of Analog Devices (ADI) discuss methods for measuring loop response when the top feedback resistor is inaccessible.
2025.06.02 by 명세환 기자
“In the AI/HPC era, innovation in cooling technology is essential”
With AI and HPC leading technology trends in recent times, data center cooling technology is emerging as a key technology as a sustainable solution to…
2025.06.02 by 배종인 기자
NXP Brings Digital Product Passport Era Ahead… Launches NTAG X DNA Secure Connected NFC Tag
NXP Semiconductors has officially announced its new Type 4 Secure Connected NFC tag 'NTAG X DNA', establishing an important technological turning poin…
2025.05.30 by 명세환 기자
SK Hynix, direct exchange with global talents in Silicon Valley
SK Hynix will host the '2025 SK Global Forum' from May 30th through June 1st in Santa Clara, California, to realize its vision as a full-stack AI memo…
2025.05.30 by 배종인 기자
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