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Mouser Showcases Engineer Innovation Development Support Capability… Participating in KES 2024
Mouser Electronics, the industry-leading new product introduction (NPI) distributor™ handling the broadest range of semiconductors and electronic comp…
2024.10.21 by 배종인 기자
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Avnet, Automation and Advanced Robotics Support Accelerate Advanced Domestic Manufacturing Companies
Avnet, a leading global technology distributor and solutions provider (Korea Branch Director: Yong Chun Kim), is stepping up efforts to address produc…
2024.10.21 by 배종인 기자
Infineon's best-in-class fingerprint sensor helps personalize cars and make payments
Infineon Technologies (Korea CEO Lee Seung-soo) has launched the CYFP10020A00 and CYFP10020S00, best-in-class fingerprint sensor ICs for identificatio…
2024.10.21 by 배종인 기자
Microchip Receives Highest Level of Certification for Space Industry Components
Microchip Technology, a global leader in microcontrollers, mixed-signal, analog semiconductors and flash-IP solutions (Asia General Manager and Korea …
2024.10.21 by 배종인 기자
Kobo, Innovative Advancement in Semiconductor Circuit Breaker Technology
Qorvo®, a global leader in wireless communications and power solutions, has achieved a breakthrough in semiconductor circuit breaker (SSCB) technology…
2024.10.15 by 배종인 기자
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ST, Motor Drive Evaluation Board Saves 70% Board Space
STMicroelectronics, a global semiconductor company supporting diverse electronic applications and customers, has launched the three-phase driver PWD5T…
2024.10.15 by 배종인 기자
Mouser Speeds Time to Implement High-Brightness Transparent Window Displays for Automotive Applications
Mouser Electronics, an industry-leading new product introduction (NPI) distributor™ handling the broadest range of semiconductors and electronic compo…
2024.10.15 by 배종인 기자
TI, 'Power Module' Magnetic Packaging Technology Doubles Power Density and Increases Efficiency by 2%
Texas Instruments (TI) has achieved double the power density while maintaining superior thermal performance with new power modules featuring MagPack™ …
2024.10.15 by 배종인 기자
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TI, Go from concept to prototype in minutes with no-coding tools
Texas Instruments (TI) has launched a new Programmable Logic Device (PLD) that enables implementation from concept to prototype in just a few minutes,…
2024.10.15 by 배종인 기자
ST, improving smart edge performance and efficiency
STMicroelectronics (hereinafter referred to as ST), a global semiconductor company supporting diverse electronic applications and customers, has launc…
2024.10.09 by 배종인 기자
Mouser, MyIR Tech MYC-LR3568 SoM in stock
Mouser Electronics™, an industry-leading new product introduction (NPI) distributor handling the broadest range of semiconductors and electronic compo…
2024.10.09 by 배종인 기자
Kobo, Next-Generation Matter for Seamless Smart Home Connection
Qorvo®, a global leader in wireless communication and power solutions, has launched a new System-on-Chip (SoC) solution for smart home devices and is …
2024.10.07 by 배종인 기자
u-blox solves remote connectivity issues
u-blox has launched the SARA-S528NM10, its first 3GPP-compatible integrated IoT module combining terrestrial network (TN) and non-terrestrial network …
2024.10.07 by 배종인 기자
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ST and Qualcomm Join Hands for Wireless IoT Solutions
STMicroelectronics (ST), a global semiconductor company supporting diverse electronic applications and customers, and Qualcomm Technologies Internatio…
2024.10.07 by 배종인 기자
ams OSRAM Supports Motion Design with New dToF Sensor
ams OSRAM (Korean Representative Kang Seok-won), a global leader in intelligent sensors and emitters, has unveiled the TMF8806, a next-generation sing…
2024.09.25 by 배종인 기자