LG Electronics Expands Liquid Cooling Solutions for AI Data Centers
LG Electronics has recently begun demonstration testing by supplying a Coolant Distribution Unit (CDU), a liquid cooling solution, to LG U+'s mega-sca…
2025.05.29 by 명세환 기자
LG Innotek Develops World's First 5G Broadband Satellite Communication Vehicle Module
LG Innotek (CEO Moon Hyuk-soo) has successfully developed the world's first third-generation 5G communication module for vehicles that supports 5G wid…
2025.05.28 by 명세환 기자
Korea Electrotechnology Research Institute Senior Researchers Jeong Seung-yeol and Choi Hae-young Receive Government Award on Invention Day
Jeong Seung-yeol, Senior Research Fellow at the Nano Convergence Research Center, and Choi Hae-young, Senior Research Fellow at the Next-generation Ba…
2025.05.28 by 명세환 기자
Snowflake Partners with 2028 LA Summer Olympics and U.S. National Team
Global AI data cloud company Snowflake has entered into an official data partnership with the Los Angeles 2028 Olympic and Paralympic Games Organizing…
2025.05.28 by 명세환 기자
Cyber threats using AI tools increase
Global cybersecurity firm Mandiant has released findings from an analysis of a campaign by Vietnam-linked threat group UNC6032 that exploits public in…
2025.05.28 by 명세환 기자
Mouser to Supply Raspberry Pi RP2350 MCU
Global electronic components distributor Mouser Electronics is supplying Raspberry Pi's latest microcontroller, the RP2350. As the successor to the su…
2025.05.28 by 명세환 기자
Semiconductor equipment investment in 2024 to reach $117.1 billion, up 10% from the previous year
According to SEMI, an industry association representing the global electronics industry supply chain, semiconductor manufacturing equipment investment…
2025.05.27 by 명세환 기자
ECS, Bright Pattern, and Naver Cloud Join Forces for AI Contact Centers
ECS Telecom is strengthening cooperation with Bright Pattern, a global AI contact center platform company, and Naver Cloud to expand the next-generati…
2025.05.27 by 명세환 기자
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Korea Electric Power Research Institute, '37th IEC TC95' Protection Relay Standards Meeting Held for the First Time in Korea
The Korea Electrotechnology Research Institute (KERI) successfully hosted the '37th IEC TC95' international conference for the first time in Korea, wh…
2025.05.26 by 명세환 기자
NXP Unveils Automotive Development Platform 'Orange Box 2.0'… Supports SDV Transition with Enhanced Security and Connectivity
NXP has unveiled the second-generation automotive development platform 'OrangeBox 2.0', supporting the transition to SDV while enhancing automotive se…
2025.05.26 by 명세환 기자
Silicon Labs Unveils First SoC Family of 'Series 3' Platforms for IoT Innovation
Silicon Labs, a leader in low-power wireless connectivity technology, has launched a new wireless SoC product family 'SiXG301' and 'SiXG302' manufactu…
2025.05.26 by 명세환 기자
“On-Device AI, the Only Market for Domestic Fabless to Enter”
Lee Seung-woo, Director of the Research Center at Eugene Investment & Securities, presented on "On-Device AI Semiconductor Industry Trends" at the 'AI…
2025.05.26 by 명세환 기자
Intel Xeon 6 has both performance and energy efficiency
Intel has launched three new Intel® Xeon® 6 processors designed to support cutting-edge GPU-based AI systems. The new products combine Priority Core T…
2025.05.23 by 명세환 기자
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Intel Gaudi 3 Accelerates AI Innovation with Dell AI Platform
Intel has recently announced the Dell AI Platform with Intel, featuring Intel® Gaudi® 3 AI accelerators in the latest Dell AI Factory portfolio throug…
2025.05.23 by 명세환 기자
DeepX, AIC and Strategic MOU… Innovation in Edge AI Server Market
Ultra-low-power on-device AI semiconductor company DeepX (CEO Kim Nok-won) announced that it has signed a strategic memorandum of understanding (MOU) …
2025.05.23 by 명세환 기자