Logic and 4 HBMs operate as a single semiconductor
Applying silicon interposer, implementing ultra-fine wiring
Application of semiconductor process to prevent interposer deformation


Samsung Electronics announced on the 6th that it has developed a 2.5D packaging technology, 'I-Cube4 (Interposer-Cube4),' that integrates logic and four HBMs (High Bandwidth Memory) into a single package. The technology is expected to be utilized primarily in HPC, AI/cloud services, and data centers that require high-bandwidth data transmission and high-performance system semiconductors.

I-Cube technology is a 'heterogeneous integration' package technology that places logic such as CPU, GPU, and HBM on a silicon interposer to operate as a single semiconductor. By placing multiple chips in a single package, the transmission speed is increased and the package area is reduced. Samsung Electronics applied a silicon interposer to I-Cube4 technology to implement ultra-fine wiring and ensured a stable supply of power required to operate the semiconductor.

In general, as the number of semiconductor chips mounted in a package increases, the area of the interposer also increases, which increases the difficulty in the process. Samsung Electronics applied its semiconductor process and manufacturing know-how in various aspects, such as materials and thickness, to prevent deformation of the 100㎛ (micrometer) level thin interposer. In addition, it applied a unique structure that does not use a mold to efficiently dissipate heat. Samsung Electronics conducted a motion test in the middle of the packaging process to preemptively filter out defects, and shortened the production period by reducing the overall process steps.

“Based on the technological competitiveness we demonstrated this time, we plan to develop new technologies that incorporate six or eight HBMs,” said Kang Moon-soo, executive director of the market strategy team at Samsung Electronics’ Foundry Business Division. In 2018, Samsung Electronics introduced the ‘I-Cube2’ solution that integrated logic and two HBMs, and in 2020, it unveiled the ‘X-Cube’ technology that vertically stacks logic and SRAM.