▲Commemorative photo of EMC KOREA 2023
Sharing the latest EMC technology research between industry, academia, and research institutions, attended by approximately 300 people.
Advances in information and communications technology increase the challenges facing EMC engineers.
Among the domestic EMC technology events, EMC KOREA 2023, hosted by the Korean Institute of Electromagnetic Engineering and Science, boasts a long history and tradition, bringing together numerous EMC engineers and researchers from across the country.
EMC KOREA 2023 was held on the 13th at the Korea Science and Technology Center in Yeoksam-dong. Hosted by the EMC Technology Research Group of the Korean Institute of Electromagnetic Engineering and Science, the event was themed "EMC for Chip to System."
The EMC Technology Research Association presented a plaque of appreciation to Professor Kim Ji-seong of the Korea Advanced Institute of Science and Technology (KAIST), and a plaque of appreciation to Dr. Shin Jae-gon, head of the Autonomous Etugi Business Unit. Additionally, EMC scholarships were awarded to eight EMC students in undergraduate and master's/doctoral programs with funds provided by EMS.
▲Kim Jong-hoon, Chairman of the EMC Technology Research Association (CEO of EMC Doctors)
Chairman Kim Jong-hoon, who leads the EMC Technology Research Association, said, “This year’s EMC KOREA, with around 300 visitors attending online and offline, showed enthusiastic participation from industry, academia, research institutes, and government.” He added, “I would like to thank the officials who helped host EMC KOREA, which is celebrating its 25th anniversary this year, and the visitors who attended online and offline.”
In a keynote speech, Professor Yoon Kang, President of the Korea Microelectronics and Packaging Society, and Senior Professor Hwanwoo Shim of Samsung Electronics explained EMC issues and trends in semiconductor packaging and mobile devices.
President Kang Sa-yoon said, “While the semiconductor logic part can be reduced in area through microfabrication, there are limits to reducing the size of the analog part.” He added, “The diverse applications cannot be solved with semiconductors alone, and it is becoming increasingly important to figure out how to efficiently physically combine chips.”
Because packaging is a comprehensive field that requires electrical, electronic, mechanical, and chemical engineering, it is not easy to develop it into a single major or discipline. Chairman Kang added, “For EMC to be active in the packaging sector, it must not only focus on electricity and electronics, but also have an understanding of materials and properties before moving into packaging.”
▲Sim Hwan-woo, Senior Vice President of Samsung Electronics
Samsung Electronics Senior Vice President Shim Hwan-woo presented trends in mobile devices and systems EMC, explaining that intra-system-level EMC is the most problematic issue in mobile applications. He cited audio noise, RFI, and logical failure due to RF transmissions as key intra-system EMC issues.
Audio noise occurs when current flowing through audio components on a board generates a magnetic field. When this magnetic field couples to a speaker or receiver, the induced current generates noise. Senior Researcher Shim cited this as a common EMC issue in device development, stating, "We need to identify the source and design to minimize coupling."
Additionally, when power is applied to the MLCC capacitor, its physical size changes, and as the cap gets larger, the board may vibrate. Senior Shim also said, “The ‘capacitor vibration’ problem is one of the most troublesome problems once it occurs.”
In addition, regarding the RFI issue, the issue of non-linear resistance was mentioned when the current level between dissimilar metals is high when they come into contact with each other, and it was requested that measures be taken to identify the location of PIM occurrence and improve the contact surface characteristics.
▲ EMC KOREA 2023 booth display. A number of EMI/EMC companies, including EMSYS, IRETECH, and HCT, participated and showcased their solutions.
Yuk Jong-gwan, president of the Korean Institute of Electromagnetic Engineering and Science, said, “As information and communication technology advances, the number of issues that EMC engineers must solve is increasing, and the importance of EMC is being emphasized even more in semiconductors, home appliances, national defense, and automobiles.” He added, “EMC technology is an important and very difficult task that requires forming organic relationships with various systems and clearly understanding their interactions, so the value of EMC engineers is increasing even more.”
Meanwhile, the Korean Institute of Electromagnetic Engineering and Science (KIEES) Summer Conference is scheduled to be held in Goseong, Gangwon Province, on August 23rd. This year, approximately 700 papers were submitted, and a radar boot camp will be introduced for the first time.
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좋은 강연을 해 주신 발표자 분들과, 참여해 주신 EMC전문가 분들과, 준비해 주신 박현우 이사 (HCT) TFT 위원장님을 비롯한 EMC기술연구회 위원님들께 깊이 감사 드립니다.