The sustainability, electric vehicle, and data center markets require products that aid in mass production and manufacturing. This has led to efforts to automate the installation process more efficiently, with the increasing use of press-fit terminals, which provide a solution for mounting solder-free power modules onto printed circuit boards (PCBs).

Microchip Technology Inc. today announced that its SP1F and SP3F power module families now include press-fit terminals for high-volume production applications.

Microchip explains that solder-free, press-fit power module terminals enable automated or robotic installation, simplifying the assembly process, speeding up the process and reducing production costs.

The precise terminal location and new press-fit pin design of the SP1F·SP3F power modules ensure reliable connection to the PCB, reducing production time and production costs.

Microchip’s SP1F and SP3F power module families include over 200 different variants, with options using mSiC technology or Si semiconductors in a variety of topologies and grades. The SP1F and SP3F support voltages from 600 V to 1700 V and up to 280 A.

Press-fit technology allows electrical connections to be made by pressing the power module pins into appropriately sized PCB holes instead of soldering them to the PCB. One of the key advantages of this press-fit power module solution is that it eliminates the need for wave soldering. This can be a very important advantage if your PCB contains surface mount technology components.

“Microchip power modules with press-fit terminals provide customers with complete design flexibility while providing a cost-effective, high-volume production-ready power solution,” said Leon Gross, vice president of Microchip’s Discrete Products business unit. “These plug-and-play power solutions provide a reliable mounting solution for automated or robotic assembly processes.”