Texas Instruments (TI) will present scalable processing technology for a wide range of applications, including robotics, energy, and electric vehicles, at Embedded World 2024 in April.

TI announced that it will demonstrate new embedded processing and connectivity products that enable a safer, smarter, and more sustainable future at Embedded World 2024, taking place April 9-11 in Nuremberg, Germany.

TI will showcase its latest technologies for applications such as robotics, energy transition, and electric vehicles at its exhibition in Hall 3A, Booth 131.

One of the key technologies being introduced is the AI-powered smart multi-display HMI system, powered by a scalable processor. A new embedded Arm®-based processor with integrated AI accelerators boosts computing performance and enables up to three displays to run simultaneously within the most complex HMI systems.

Microcontrollers (MCUs) for industrial, medical, and automotive systems contribute to cost and design time reduction at the component and system level by providing options to fit every design requirement for memory, analog integration, or size.

TI will also showcase its TDA4VM, a high-performance, high-performance integrated circuit (IC) for the mobile robot safety controller (MRSC) of Amazon Robotics' Proteus autonomous mobile robot (AMR), at the show.We will introduce the use of integrated embedded processors and demonstrate the importance of innovative semiconductors in the safety system area for next-generation AMR applications.

Additionally, it showcases embedded technologies and reference designs for perception sensing, precision motor control, real-time communication, and AI capabilities.

Technologies in the areas of power conversion, connectivity and control for energy systems are also introduced.

We will demonstrate a bidirectional GaN-based solar microinverter capable of monitoring the voltage of each inverter using wireless connectivity and rapidly shutting down the voltage over a Sub-1 GHz wireless network based on Internet Protocol v6, and demonstrate how to commission the microinverter over Bluetooth® LE using a smartphone, all in a single dual-band device.

Additionally, a tested and ready-to-use reference design for a variable frequency air conditioner outdoor unit controller in heating, ventilation, and air conditioning (HVAC) applications will be presented.

We will also cover sensorless three-phase permanent magnet synchronous motor vector control for compressor and fan motor drives, and how to meet new efficiency standards with digital interleaved boost power factor correction (PFC) on a single C2000™ MCU.

TI experts will discuss the various hardware, software and design tools available in the TI Developer Zone, including TI's portfolio of processors, MCUs, wireless connectivity and radar-based devices that help engineers more easily develop embedded systems.

“Advances in embedded processing are redefining the potential of industrial and automotive applications worldwide,” said Amichai Ron, senior vice president of embedded processing at TI. “This includes robotic arms, software-defined vehicles (SDVs), energy “With a variety of subsystems and functions, including the Energy Storage System (ESS), we can now implement more sensing, motor control, communication, and edge AI capabilities than ever before,” he said.

For more information on the technologies TI will showcase at Embedded World 2024, visit ti.com/ew.