SK Hynix also boasted its status as a leading AI memory company with the 5th generation HBM3E DRAM.

SK Hynix announced on the 19th that it will be the first in the world to mass produce HBM3E, a new ultra-high-performance AI memory product, and begin supplying products from the end of March. This is seven months after the announcement of the development of HBM3E in August of last year.

HBM, a high value-added, high-performance product that innovatively increases data processing speed compared to existing DRAMs by vertically connecting multiple DRAMs, was developed in the following order: 1st generation (HBM) - 2nd generation (HBM2) - 3rd generation (HBM2E) - 4th generation (HBM3) - 5th generation (HBM3E). HBM3E is an extended version of HBM3.

SK Hynix stated, “Following HBM3, we are the first to supply HBM3E, which has the highest performance of any DRAM available, to our customers,” and “We will successfully mass-produce HBM3E and continue our competitive edge in the AI memory market.”

In order to implement an AI system that must quickly process a huge amount of data, the semiconductor package must be configured to multi-connect numerous AI processors and memories. Accordingly, global big tech companies that are increasing their investments in AI are continuously raising the level of demand for AI semiconductor performance, and SK Hynix expects that HBM3E will be the best product available today to satisfy this demand.

HBM3E emphasized that it has satisfactory performance in all areas required for AI memory, such as speed and heat control. The product processes up to 1.18 TB (terabytes) of data per second, which is equivalent to processing data equivalent to more than 230 FHD (Full-HD) movies (5 GB) in just one second.

In addition, since AI memory must operate at extremely high speeds, effective heat control is key. To this end, the company applied the Advanced MR-MUF* process to the new product, improving heat dissipation performance by 10% compared to the previous generation.

SK hynix Vice President Ryu Sung-soo (in charge of HBM Business) said, “With the world’s first mass production of HBM3E, we have further strengthened our product lineup that leads the AI memory industry,” and “Based on the successful HBM business experience we have accumulated so far, we will strengthen customer relationships and solidify our position as a ‘total AI memory provider.’”