도시바 일렉트로닉 디바이스 앤 스토리지 코퍼레이션(Toshiba Electronic Devices & Storage Corporation)의 주요 그룹 계열사 중 하나인 가가 도시바 일렉트로닉스 코퍼레이션(Kaga Toshiba Electronics Corporation)에서 전력 반도체를 위한 새로운 300㎜ 웨이퍼 팹 시설을 준공했다.
300mm fab completed, mass production targeted for the second half of the year
Toshiba Electronic Devices & Storage Corporation has completed construction of a new 300mm wafer fab facility, marking the start of a full-scale expansion of its power semiconductor supply.
Toshiba held a ceremony on the 23rd to mark the completion of a new 300mm wafer fab facility for power semiconductors and an office building at Kaga Toshiba Electronics Corporation, one of Toshiba's major group affiliates in Isagawa Prefecture, Japan.
Toshiba plans to install the equipment, aiming for mass production in the second half of fiscal 2024.
Once Phase 1 is fully operational, Toshiba's power semiconductor production capacity is expected to be 2.5 times that of fiscal 2021, when the investment plan was established, focusing on MOSFETs and IGBTs.
The decision on the commencement of Phase 2 construction and operation will be made based on market trends.
The new manufacturing facility features seismic isolation to absorb earthquake shocks and redundant power sources. It also has the ability to meet 100% of its power needs with renewable energy sources and solar panels on the building’s roof.
Product quality and production efficiency are improved by utilizing artificial intelligence (AI). Toshiba expects to receive subsidies from Japan's Ministry of Economy, Trade and Industry for some of its investments in manufacturing equipment.
Power semiconductors play a vital role in power supply and control, and are essential devices for the energy efficiency of all electrical equipment.
As electrification of automobiles and automation of industrial machinery continue, continued growth in demand is expected.