Texas Instruments (TI) is expected to ease the burden on developers responsible for power design by launching a new power module that uses magnetic materials to reduce size by 50% compared to existing models, increase power density, and reduce EMI by 8dB, enabling high output in small spaces.

TI Korea (CEO Park Joong-seo) announced at a press conference on the 6th that it recently released six new power modules.

Allie Ahang, TI Boost/Buck-Boost business lead, who made the announcement that day, said the newly launched power modules leverage TI’s proprietary MagPack integrated magnetic packaging technology to reduce size by up to 23 percent compared to competitive modules and 50 percent compared to TI’s own products.

In particular, among the six new devices, the TPSM82866A, TPSM82866C, and TPSM82816 are said to be the industry's smallest 6A power modules, offering industry-leading power density of approximately 1A per 1㎟ area.

In power design, ‘size’ is a very important factor. Power modules combine power chips and transformers or inductors into a single package, simplifying power design and saving valuable board space.

MagPack packaging technology, which leverages TI's proprietary 3D package molding process, maximizes the height, width and depth of power modules, enabling more power in a smaller space.

MagPack magnetic packaging technology includes a newly designed, proprietary material integrated power inductor. As a result, engineers can achieve best-in-class power density, reduce temperature and radiant emissions, while minimizing both board space and system power loss.

With some analysts today predicting that electricity demand will increase 100% by the end of the decade, the ability to minimize power losses is especially important in applications such as data centers where power is the largest cost factor.

TI's newly launched products are expected to see increased demand in areas that require high power but have space constraints, such as data centers and servers, test & measurement, transportation such as railways, and wireless infrastructure.

TI's power modules feature a portfolio of more than 200 devices, package types optimized for the power design or application, along with decades of expertise, innovative technologies, and help designers enhance their power.

Pre-production quantities and evaluation modules starting at $49 for the new power modules in MagPack packaging technology are available now on TI.com with multiple payment and shipping options.