Samsung Electronics is set to enter the mobile DRAM market in earnest by mass producing LPDDR5X DRAM, which has the industry's thinnest thickness, through packaging technology optimization such as the back-wrap process.

Samsung Electronics announced on the 6th that it will begin mass production of 0.65mm thick 12nm-class LPDDR5X DRAM 12/16GB (gigabyte) packages.

This product is the thinnest 12GB or larger LPDDR DRAM currently available.

Samsung Electronics stacked the industry's smallest 12nm LPDDR DRAM in four layers and optimized packaging technology, package circuit board, and EMC technology to reduce the thickness by approximately 9% and improve thermal resistance by approximately 21.2% compared to the previous generation.

In addition, the technology of the back-lap process, one of the packaging processes, was maximized to make the wafer as thin as possible and implement a minimum thickness package.

This product has additional space secured by its reduced thickness, which helps to induce smooth airflow and control the temperature inside the device.

On-device AI, which generally requires high performance, has a temperature control function (throttling) that limits performance when the device temperature exceeds a certain range due to heat generation.

Equipping this product can minimize the time when the function operates due to heat generation, thereby minimizing the decrease in device performance such as speed and screen brightness.br />
Samsung Electronics plans to continue to supply solutions optimized for the needs of customers in the on-device AI era by developing 24GB modules based on a 6-stage structure and 32GB modules based on an 8-stage structure in the thinnest LPDDR DRAM package in the future.

“As demand for high-performance on-device AI increases, not only the performance of LPDDR DRAM but also improved temperature control capabilities have become important,” said Bae Yong-cheol, Executive Vice President and Head of Product Planning at Samsung Electronics’ Memory Business. “Samsung Electronics will continue to develop low-power DRAMs that are thinner than existing products and provide optimized solutions through close collaboration with customers.”

Samsung Electronics plans to further expand the low-power DRAM market by supplying this 0.65mm LPDDR5X DRAM to mobile application processors and mobile companies in a timely manner.