SK하이닉스 곽노정 대표이사 사장이 ‘SK AI 서밋(Summit) 2024’ 기조 연설을 통해 “세계 최초(World First), 최고 지향(Beyond Best), 최적 혁신(Optimal Innovation)의 기술력으로 AI 시대 주도할 것”이라고 밝혔다.

▲SK Hynix President Kwak No-jeong is giving a keynote speech at the 'SK AI Summit 2024.'
HBM4 16-layer full-scale launch, customer samples to be provided early next year
LPCAMM2 development, 1cnm-based LPDDR5·6 development in progress
“We will lead the AI era with world-first, beyond-best, and optimal innovation technologies.”
SK Hynix CEO Kwak No-jeong gave a keynote speech on the topic of “A New Journey of Next-Generation AI Memory, Beyond Hardware to Everyday Life” at the “SK AI Summit 2024” held at COEX in Samseong-dong, Seoul on the 4th.
CEO Kwak No-jeong said that recording and leaving behind something is a human instinct, and that past murals and paper are now being converted into data through memory semiconductors. He also said that in the upcoming era of AI, memory will have an expanded meaning of 'creativity' and 'experience.'
This is the 'Creative Memory' that SK Hynix envisions for the future, and he emphasized that this change cannot be realized without next-generation memory semiconductors that support powerful computing power.
To this end, SK Hynix is currently developing and mass producing the world's first ‘ He mentioned that they are preparing various 'World First' products and planning 'Beyond Best' products with the highest competitiveness. He also said that they will introduce 'Optimal Innovation' products for system optimization in the AI era.
First of all, the 16-layer market is expected to open in earnest starting with HBM4, and in preparation for this, SK Hynix is developing a 48GB 16-layer HBM3E to secure technological stability, and announced that it plans to provide samples to customers early next year.
In particular, to produce the 16-layer HBM3E, SK Hynix plans to utilize the Advanced MR-MUF process, which has proven its mass production competitiveness in 12-layer products, and also mentioned that it is developing hybrid bonding technology as a backup process.
In addition, the company is developing the LPCAMM2 module, which is expected to be used in PCs and data centers in the future due to its low power and high performance, and is developing 1cnm-based LPDDR5 and LPDDR6. Additionally, NAND announced that it is preparing PCIe 6th generation SSD, high-capacity QLC-based eSSD, and UFS 5.0.
Furthermore, it was mentioned that the logic process will be introduced to the base die starting with HBM4.
In addition, Custom HBM is a product that optimizes performance by reflecting various customer needs such as capacity, bandwidth, and additional functions, and it was announced that it will become a new paradigm for future AI memory.
Lastly, he said that they are developing technologies to add computational functions to memory to overcome memory bottlenecks, and that technologies such as Processing in Memory (PIM) and Computational Storage are essential technologies for the future that will handle extremely large amounts of data, and will be a great challenge to change the structure of next-generation AI systems and the future of the AI industry.

▲SK Hynix President Kwak No-jeong is giving a keynote speech at the 'SK AI Summit 2024.'