SK Hynix is solidifying its market leadership by launching HBM4 12-layer in 2025 in the HBM market, which is expected to grow at an average annual rate of 109% until 2025.

Lee Kang-wook, Vice President of SK Hynix (in charge of PKG development), gave a session presentation on the topic of 'HBM (High Bandwidth Memory) and Advanced Packaging Technology for the AI Era' at SEMICON TAIWAN on the 3rd.

Vice President Lee Kang-wook said that in the era of AI and high-performance computing (HPC), data traffic is rapidly increasing, and the demand for improved memory bandwidth is growing. The current highest specification DRAM to overcome system bottlenecks arising from memory performance is HBM, and it is also said to be the optimal product for training and inference of AI systems.

HBM is being widely adopted as a memory for AI servers and high-performance computing, and it is expected that the average number of HBMs installed in training and inference AI servers will increase as the HBM generation advances, depending on the application.

The current 8- and 12-layer HBM3E processes more than 1.18TB of data per second and supports a maximum capacity of 36GB, while HBM4 is supplied in 12 and 16 layers, with a capacity of up to 48GB and a data processing speed of more than 1.65TB per second. It was also mentioned that starting with HBM4, by applying the logic process to the base die, performance and energy efficiency improvements are expected.

As HBM performance advances, demand for HBM is also expected to increase further in the AI market. The generative AI market is expected to grow at an average of 27% per year from 2023 to 2032, while the HBM market is already expected to grow at an average of 109% per year from 2022 to 2025.

In line with this market growth, SK Hynix, a leader in the HBM field, plans to launch a 12-layer HBM4 product in 2025. In particular, SK Hynix has overwhelming product competitiveness in terms of energy efficiency and heat dissipation (heat dissipation performance) of HBM products through its independently developed innovative packaging technology.

The MR-MUF packaging technology applied by SK Hynix to HBM products is advantageous over other processes in terms of productivity and reliability as it allows for low bonding (chip joining) pressure/temperature application and batch heat treatment.

In addition, it is possible to form Gap-Fill materials (materials that fill empty spaces) with high thermal conductivity and high-density metal bumps (materials in the form of ultra-small protrusions that serve as circuit connections when vertically stacking HBM DRAMs), giving it a performance advantage of more than 30% in terms of heat dissipation compared to other processes.

SK Hynix is currently mass producing HBM3 and 3E 8-layer products using MR-MUF technology, and 12-layer products using Advanced MR-MUF technology, and plans to mass produce HBM4 12-layer products scheduled for shipment in the second half of next year using Advanced MR-MUF technology.

We are preparing for both Advanced MR-MUF and hybrid bonding methods for 16-stage products and plan to select the optimal method to meet customer needs.

SK Hynix is developing technology to support 16-layer products, and recent research has confirmed the possibility of applying Advanced MR-MUF technology to 16-layer products.

Although hybrid bonding technology has advantages in terms of product performance, increased capacity, and heat dissipation, there are several prerequisites that must be addressed in terms of technological perfection and preparation of mass production infrastructure.

We plan to rapidly improve the technological perfection of both methods to proactively respond to customer needs for increased memory capacity.

Vice President Lee Kang-wook said, “SK Hynix is preparing to develop HBM4 and subsequent generation products, and is focusing on bandwidth, capacity, and energy. “In order to resolve technical challenges in terms of efficiency, we are reviewing various response measures, including 2.5D and 3D SiP (System in Package) packaging,” he said. “As HBM4E is expected to have a stronger custom character, we are also strengthening cooperation with global partners from the perspective of building an ecosystem to efficiently respond to diverse customer needs.”