Intel expressed confidence in its technology, saying that it will release Panther Lake, which uses 18A (Angstrom) technology, as scheduled in the second half of 2025.

Intel recently released a video on social media including Facebook, X, and Instagram, and announced that the Intel 18A process is going smoothly.

According to the released video, the core of Panther Lake is Intel's latest process technology, RibbonFET and PowerVia.

RibbonFET is a gate-all-around (GAA) transistor technology that maximizes space efficiency and delivers fast performance while minimizing power consumption.

This is a significant advancement that symbolizes Intel's technological innovation, as it dramatically increases transistor density while enabling efficient power management.

PowerVia is an industry-first backside power technology that places power connections on the back of the chip, freeing up front space for data flow.

This innovation offers groundbreaking possibilities for optimizing chip performance while extending battery life and reducing energy consumption.

Manufactured using the 18A process with these two innovative technologies, Panther Lake represents a huge leap forward in performance, density, and power efficiency compared to previous-generation chips.

Intel says this new product goes beyond mere technological advancements.He expressed strong confidence that it would provide guests with the infinite possibilities of cutting-edge technology.