Global simulation company Ansys is expected to play a key role in ensuring the reliability of next-generation semiconductor systems through power and electromagnetic integrity certification of Intel's 18A process.

Ensys has obtained thermal and multi-physics verification tool certification required for semiconductor design using Intel 18A (1.8nm) process technology.

This certification plays a critical role in ensuring the reliability of next-generation semiconductor systems such as AI chips, GPUs, and high-performance computing (HPC).

ANSYS and Intel Foundry have jointly developed a comprehensive multi-physics validation analysis flow supporting Embedded Multi-Die Interconnect Bridge (EMIB) and EMIB-T technologies.

This will enable more effective support for the implementation of 3D integrated circuit (3D-IC) systems.

Ansys' flagship solutions, Ansys RedHawk-SC™ and Ansys Totem™, provide power integrity and reliability analysis capabilities based on Intel's Gate-All-Around (GAA) transistor RibbonFET and PowerVia technologies, and HFSS-IC Pro has achieved certification for electromagnetic (EM) integrity analysis of radio frequency (RF) chips and communication applications.

Additionally, ANSYS has joined the Intel Foundry Chiplet Alliance to contribute to building an interoperable chiplet design and manufacturing ecosystem.

We plan to continue our cooperation in activating Intel's 14A-E process in the future, and the Intel 18A-P process certification process is also in progress.