Intel is pushing ahead with 18A and 14A processes and providing system-level integration with advanced packaging technology. It will also strengthen its manufacturing capabilities in the United States and open its Arizona plant in 2026.

Intel highlighted its global manufacturing and supply chain capabilities by unveiling next-generation semiconductor processes and advanced packaging technology at the 'Intel Foundry Direct Connect' event held in San Jose, USA on the 29th.

We also announced new ecosystem programs and partnerships, demonstrating how our System Foundry approach empowers customer innovation and collaboration.

Intel is currently in risk production with the 18A process and aims to enter volume production within this year.

In addition, the company announced that it is actively pursuing the follow-up process, 14A, with key customers and that many companies plan to produce test chips at the new process node.

The 14A process further enhances performance by applying the PowerDirect method, which is an advanced version of PowerVia technology, and derivative processes 18A-P and 18A-PT based on 18A are also being developed.

In particular, the 18A-PT utilizes Foveros Direct, a 3D stacking technology, with a hybrid bonding interconnect pitch of less than 5 micrometers (μm).

At the event, Intel showcased its latest packaging technologies, including Foveros Direct (3D stacking), EMIB-T, Foveros-R, and Foveros-B, which it said will support future high-bandwidth memory (HBM) demands.

We also work with Amkor Technology to provide customers with greater flexibility in choosing the packaging solution that best suits their needs.

Intel has launched its first wafer fabrication facility at Fab 52 in Arizona, USA.With the completion of the Epher process, we have confirmed that the establishment of a production system in the United States is progressing smoothly.

Intel's 18A wafer production will begin first in Oregon later this year, with Arizona to follow in 2026.

Intel is strengthening its foundry customer service by partnering with Synopsys, Cadence, Siemens EDA, and PDF Solutions, and is also expanding its collaboration with MediaTek, Microsoft, and Qualcomm.

We have also strengthened our collaboration with ecosystem partners by adding new programs such as the Intel Foundry Chiplet Alliance and the Value Chain Alliance.

“Intel’s top priority is to listen to our customers’ voices and provide innovative solutions based on trust,” said Intel CEO Lip-Bu Tan. “We will regain leadership in the market in the long term through cutting-edge process and packaging technologies.”