반도체 및 첨단 웨이퍼 레벨 패키징(WLP) 애플리케이션을 위한 웨이퍼 처리 솔루션 전문 기업인 ACM 리서치(ACM Research, Inc.)가 진공 기술과 IPA 건조 기술을 활용해 세정 효율을 높여 경제적이고 효율적인 반도체 첨단 패키징을 구현했다.
Ultra C vac-p panel level advanced packaging vacuum cleaning equipment launched
ACM Research, Inc., a specialist in wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, has implemented economical and efficient semiconductor advanced packaging by increasing cleaning efficiency using vacuum and IPA drying technologies.
ACM announced today the launch of its Ultra C vac-p vacuum cleaning equipment suitable for fan-out panel level packaging (FOPLP) applications.
This equipment removes flux residues within the chiplet structure using vacuum technology, significantly improving cleaning efficiency.
This signifies ACM’s successful entry into the high-growth fan-out panel-level packaging market.
ACM announced that a major Chinese semiconductor manufacturer has ordered its Ultra C vac-p panel-level vacuum cleaning equipment, which was delivered to the customer's plant in July.
“FOPLP is emerging as a key technology as the AI, data center and autonomous vehicle markets demand more computational power, lower latency and higher bandwidth,” said Dr. David Wang, president and CEO of ACM. “FOPLP integrates multiple chips, passive components and interconnects into a single package on the panel, providing greater flexibility, scalability and cost efficiency.”The Ultra C vac-p panel-level vacuum cleaning system represents ACM’s significant step forward in solving cleaning challenges for next-generation advanced packaging technologies and is a symbol of ACM’s continued innovation in semiconductor manufacturing. It is a testament to ACM’s unwavering commitment to continually meet the industry’s evolving needs,” said Mr.
According to Yole Group, the application growth rate of fan-out panel-level packaging method is faster than the overall fan-out market growth rate, and the market share is expected to increase from 2% in 2022 to 8% in 2028.
The main driver of FOPLP growth is cost reduction. For example, traditional silicon wafers are circular in shape, so the wafer utilization rate is less than 85%, while panels are rectangular or square in shape, so the wafer utilization rate is more than 95%.
The effective area of a 600 x 600㎜ panel is 5.7 times that of a conventional 300㎜ silicon wafer, enabling an overall cost reduction of approximately 66%. This increase in area utilization results in higher productivity, greater AI chip design flexibility, and significant cost savings.
Ultra C vac-p equipment handles critical steps in the advanced packaging process, particularly the removal of flux residue prior to underfill, which is essential to eliminating voids or underfill gaps.
Conventional cleaning methods have difficulty handling small bump spacing (less than 40 micrometers) and large chips due to surface tension and limited liquid penetration.
ACM's new equipment effectively solves this problem by allowing cleaning fluid to reach narrow crevices through vacuum cleaning.
Additionally, it can meet the cleaning needs of large chip units that could not be handled by conventional methods because the cleaning solution must pass a longer distance.
This vacuum cleaning function equipment combines ACM's unique IPA drying technology to thoroughly clean the entire chip unit, even the central part, effectively preventing residues from affecting device performance.
The Ultra C vac-p panel level vacuum cleaning equipment is designed for panels made of organic or glass materials.
The machine can handle panels measuring 510 x 515mm and 600 x 600mm and panel warpage up to 7mm.