LG Electronics (CEO Joo-wan Cho) is expanding its thermal management solution business in earnest by leveraging its HVAC (Heating, Ventilation and Air Conditioning) technology. In particular, it is accelerating its liquid cooling business optimized for data centers, which are rapidly growing in the AI era.

LG Electronics will participate for the first time in 'Data Center World (DCW) 2025' held in Washington D.C., USA from the 14th to the 17th (local time).

We are solidifying our position as a prepared player through a lineup of various cooling solutions developed based on HVAC technology in the data center market, such as liquid cooling solutions (CDU; Coolant Distribution Unit). DCW is an exhibition in which big tech and semiconductor companies also participate, and seminars and business meetings on various topics such as AI technology and trends, infrastructure construction, and energy efficiency are held.

Liquid cooling solutions are methods of directly attaching a metal cold plate to the CPU, GPU, and other chips that generate a lot of heat in the server, and sending coolant to the cold plate to cool the heat. As CPUs and GPUs increase their calculations, they generate more heat, so a solution that effectively manages the heat is essential. AI data centers generate more heat than conventional data centers due to their high server rack density and large number of chips. The method of cooling chips directly is attracting attention as a next-generation technology because it requires less installation space and is more energy efficient than the air cooling method.

LG Electronics CDU is a solution that directly cools the heat of chips within a data center, and has implemented stability and high efficiency through core component technology (Core Tech). The virtual sensor technology applied to the CDU utilizes the pump and other sensor data to correct the failed sensor value even if the main sensor fails, and operates the cooling system stably. In addition, the pump applied with high-efficiency inverter technology discharges only the necessary amount of cooling water depending on the situation, resulting in high energy efficiency. LG Electronics aims to complete the development of the CDU by the first half of this year and supply it in earnest to global customers' AI data centers within the year.

LG Electronics' flagship chiller product, the 'Oil-Free Inverter Turbo Chiller', is also introduced. This product lowers the temperature inside the data center room through air cooling and operates stably by utilizing AI technology. The magnetic bearing technology that supports and rotates the rotating shaft of the high-speed compressor motor by floating it in the air with electromagnetic force is applied, reducing friction loss and increasing energy efficiency. In addition, the FWU (Fan Wall Unit) that precisely controls airflow by applying a high-efficiency fan and motor developed in-house is also unveiled.

LG Electronics also proposes a hybrid solution optimized for the next-generation AI data center structure. It is a method that combines liquid cooling and air cooling methods to provide the optimal cooling solution for AI data centers that use high power and intensively generate more heat.

LG Electronics is also introducing the BECON (Building Energy Control) system for integrated management of buildings through AI-based real-time energy analysis. Beacons help reduce energy consumption by precisely analyzing temperature and power usage within a building and automatically controlling the system.

LG Electronics recently built a dedicated AI data center test bed (LG AI Data Center HVAC Solution Lab) at the Pyeongtaek chiller plant to implement various environmental conditions of AI data centers and provide customers with optimal solutions. Server racks have been installed in this test bed and systematic cooling tests are being conducted using CDU, chillers, and FWUs. The 'immersion cooling' method, which directly immerses servers and equipment in insulated liquid, is also being researched and developed.

LG Electronics established the ES (Eco Solution) division late last year to accelerate the growth of its HVAC business. With the goal of achieving compressed growth twice as fast as the market in the cleantech sector, the ES division is leading the digitalization of the air conditioning industry using AI technology and actively responding to new growth business opportunities such as AI data center cooling systems, which are in increasing demand, as well as nuclear power plants and mega factories.

“LG Electronics is a prepared player with various AI data center cooling solutions, such as chillers and CDUs, as well as ultra-large air conditioners,” said Vice President Lee Jae-sung, head of LG Electronics ES Business Division. “We will accelerate the growth of our B2B business based on differentiated HVAC technology.”