TI Unveils Multi-Axis Coreless Current Sensor TMCS2100-Q1 for HEV/EV Traction Inverters

Texas Instruments has unveiled the TMCS2100-Q1, a multi-axis coreless Hall-effect current sensor for HEV and EV traction inverters. By simultaneously ..

2026.08.27 by 배종인 기자

Automotive Research Institute to Participate in '2026 Autonomous Mobility Industry Exhibition'

The Korea Automotive Research Institute will participate in the 2026 Autonomous Mobility Industry Exhibition to showcase research results in AI-based ..

2026.08.25 by 배종인 기자

TUV SUD Expands Five Specialized Educational Programs Including Automotive AI Safety, CBAM, and Explosion Protection

TUV SUD will sequentially open five specialized educational programs in September through November covering automotive AI safety, Carbon Border Adjust..

2026.08.24 by 명세환 기자

Anritsu Supports BMW Group Hybrid eCall Verification…Securing Compliance with Europe's Latest eCall Standard

Anritsu has strengthened its response to European automotive communication standards by supporting verification of BMW Group's next-generation emergen..

2026.08.21 by 배종인 기자

The Invisible Neural Network War: Vehicle Communication SDV Competitiveness Surges

In the SDV era, vehicles are evolving into "mobile computers," and a clear trend is emerging where communication quality directly becomes vehicle perf..

2026.08.20 by 배종인 기자

CES Asia Unveiled Seoul, Held at Korea Electronics Show in October

The Consumer Technology Association (CTA) and Korea Electronics Association (KEA) will jointly host 'CES Asia Unveiled Seoul' at Seoul COEX from Octob..

2026.08.20 by 명세환 기자

LG Electronics, First Application of R16-Based 5G Telematics in European OEM Vehicles

LG Electronics is supplying R16-based 5G telematics solutions for vehicles to European OEMs for the first time. By integrating a communication module ..

2026.08.19 by 명세환 기자

[EDA Great Transformation ③] Korea Was Already in the Midst of the EDA War

Competition among global EDA companies is intensifying in the Korean market, centered on Samsung's 2nm and HBM and 3D stacking. AI-based design automa..

2026.08.12 by 배종인 기자

[EDA Great Transformation ②] AI Agents are Converging...The Real Competition Ground for EDA's Big Three is 'Physics Engine'

Synopsys, Cadence, and Siemens EDA have entered a competition in 'Agentic EDA' where AI directly executes and validates design tools. Synopsys expand..

2026.08.12 by 배종인 기자

[EDA Great Transformation ①] The Era of AI Designing Chips…EDA Competition Shifting from 'Speed' to 'Trust'

As 'self-verifying' designs in which AI directly executes, validates, and corrects EDA tools become widespread, the core of EDA competition is shiftin..

2026.08.12 by 배종인 기자

[Interview] Lee Jun-ho, Director at Monolithic Power Systems (MPS), "Stable Power Solutions Support Essential for SDV Transition"

2026.08.10 by 배종인 기자

[Serial Planning-The SDV Era Has Arrived③] The Real Brain War in Automobiles, the Winner Will Be Decided in 2027

Through the case of The all new AVANTE, the core of the SDV industry in 2026 is that 'experience-layer SDV' is mainstream. Infotainment, app, and AI-c..

2026.08.07 by 배종인 기자