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"Support for simplifying inverter design to improve motor efficiency"
To improve energy efficiency, electronic device manufacturers are equipping their products with devices made from high-efficiency materials such as Si..
2021.06.18 by 이수민 기자
ADI Launches Industrial Long-Range Ethernet PHY Solution
Many industrial process plants and buildings face the challenge of requiring service personnel to remain on-site for continuous manual involvement in ..
2021.06.18 by 이수민 기자
ST Announces World's First G3-PLC Hybrid Certified Chipset
The G3-PLC hybrid specification enables smart grid, smart city, and industrial/IoT devices to automatically and dynamically select appropriate wireles..
2021.06.17 by 이수민 기자
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[China Briefing] Xiaomi Patents Curved Fingerprint Recognition
e4ds News China ICT Briefing - June 17, 2021 [China Brief] : ◇Xiaomi to add fingerprint unlock feature on curved screen edge ◇PSMC begins 2023 order n..
2021.06.17 by 이수민 기자
FLIR Thermal Camera Adopted in Protec's Advanced Semiconductor Packaging Equipment
Teledyne FLIR Korea (Branch Manager Lee Hae-dong) announced on the 16th that its FLIR A315 thermal camera has been adopted in advanced LAB (laser-assi..
2021.06.16 by 명세환 기자
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ST Completes China's MI Smart Lock Using MCU and Security Technology
Magic Information's smart lock solution utilizes AIoT fingerprint recognition technology running on ST's STM32WB55 Bluetooth® LE microcontroller (MCU)..
2021.06.16 by 강정규 기자
[China Briefing] Qualcomm Resumes Semiconductor Supply to Huawei, Etc.
e4ds News Chinese ICT Updates - June 14, 2021 [China Briefing]: ◇Not only TSMC expressed anger over Qualcomm's resumption of Huawei supplies ◇MediaTek..
2021.06.14 by 이수민 기자
Telit 'LM960A18' Module Passes U+ LTE '3CA' Certification
Telit announced that its LM960A18 module has received LTE network certification from LG U+. The LM960A18 product, provided in an mPCIe data card form ..
2021.06.14 by 강정규 기자
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Arm Announces Two MCU Solutions to Boost IoT Device Compatibility
Most things in the Internet of Things (IoT) are composed of MCU-based devices. Accordingly, ensuring software compatibility for component reuse has be..
2021.06.14 by 이수민 기자
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Xilinx Announces Low-Power ACAP to Enable Edge AI
Xilinx has launched the "Versal AI Edge" series, which delivers 4x better AI performance per watt compared to GPUs and 10x higher computing density th..
2021.06.11 by 이수민 기자
[China Briefing] TSMC to Build Japanese Fab Near Sony, etc.
e4ds News China ICT Brief - June 11, 2021 [China Briefing]: ◇TSMC to Build Fab in Kumamoto, Japan "Plans to Locate Adjacent to Sony" ◇China Unicom Gan..
2021.06.11 by 이수민 기자
PTC Simplifies Building CAD-Based Employee Training Materials
PTC announced that it has added Vuforia Instruct, a new SaaS-based AR offering, to its Vuforia Enterprise AR suite. Vuforia Instruct is an offering av..
2021.06.11 by 이수민 기자