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Infineon Launches 'ASIL D Satisfied' Monolithic Linear Hall Sensor
Infineon Technologies is launching a single integrated linear Hall sensor that meets the automotive safety standard ISO26262. Through the XENSIV TLE49..
2019.06.21 by 이수민 기자
Schneider Electric Hosts 'Innovation Day Seoul 2019' to Experience EcoStruxure
Schneider Electric will hold Innovation Day Seoul 2019 on July 4 at the Four Seasons Hotel Seoul in Gwanghwamun, Seoul. This event serves as an opport..
2019.06.21 by 이수민 기자
Siemens Launches Solid Edge 2020, Enhancing Design Visualization with Added AR Capabilities
Siemens Digital Industries Software has released the latest version of Solid Edge software 2020. This version includes various functional improvements..
2019.06.20 by 이수민 기자
Popularizing and miniaturizing AI computing, fostering an AI ecosystem
As companies and organizations increasingly seek to apply AI to their business, interest in AI hardware is growing. With more and more entities lookin..
2019.06.19 by 이수민 기자
Samsung Electronics to Open System Semiconductor Business with NPU
An NPU is a processor optimized for deep learning algorithm computations. Deep learning algorithms require parallel computing technology capable of si..
2019.06.18 by 이수민 기자
Dreamtech Enables Real-Time Factory Energy Monitoring with Schneider Electric's EcoStruxure Power
Schneider Electric has built an energy-saving solution at DreamTek's new factory. DreamTek's new factory, which was completed in December 2018, has a ..
2019.06.17 by 이수민 기자
Mouser Hosts Seminar on "Noise Reduction and Power-Efficient Power Supply Design for the 5G Era"
Mouser Electronics will hold the 2019 Mouser Power Design Seminar on the 21st at Conference Room 327, COEX, Samseong-dong, Seoul. At this seminar, Mou..
2019.06.14 by 이수민 기자
TI Launches Automotive System-Based Chip with Integrated CAN FD Controller and Transceiver
Texas Instruments announced the launch of an automotive system-based chip product that integrates a CAN FD controller and transceiver. The TCAN4550-Q1..
2019.06.14 by 이수민 기자
Characteristics and prospects of the three next-generation memories that have entered the commercialization stage: MRAM, PCRAM, and ReRAM
Three new memory technologies—MRAM, PCRAM, and ReRAM—are entering the commercialization phase after decades of research, presenting significant opport..
2019.06.13 by 이수민 기자
Semiconductors are the key to implementing connected smart factories.
As the use of automated and autonomous systems increases, factories are becoming less dependent on labor forces to handle repetitive and complex manua..
2019.06.12 by 이수민 기자
KT Expands 5G Ecosystem by Opening Pangyo 5G Open Lab
KT has opened the Pangyo KT 5G Open Lab at the Pangyo Startup Campus, enabling startups and general developers to develop 5G services utilizing the 5G..
2019.06.11 by 이수민 기자
Potential to dramatically increase the speed and capacity of next-generation memory semiconductor MRAM discovered
Professor Jung Myung-hwa's research team at Sogang University has demonstrated the potential to further advance the speed and storage capacity of magn..
2019.06.10 by 이수민 기자