웨비나
PCB Heat Source Check and Supplementation Seminar for Minimizing Mass Production Defect Risk in Yangsan
FloTHERM has announced its latest version 12.0, the most powerful and technology-leading computational fluid dynamics solution for thermal analysis of electronic equipment in the industry. The latest version includes various features added to enhance user usability and productivity as follows.
First, the Command center has a GUI similar to modeling, enabling rapid experimental design planning and optimization.
Second, it supports phase change material (PCM) thermal analysis. Transient thermal analysis of phase change materials is possible based on latent heat, specific heat, and melting temperature.
Third, PCB designs can be imported into FloTHERM using ODB++, the PCB industry standard data format. Through support for blind vias and buried vias, more accurate thermal transfer analysis within the PCB is possible.
Finally, the enhanced parallel solver provides faster and more scalable results across various environments.
This webinar includes a demonstration of calibration work for IGBT FloTHERM simulation models using T3Ster measurement results. Through this, improvement in simulation model accuracy and reliability is possible.
We hope you will participate in this webinar and find it to be a valuable session. Thank you.
First, the Command center has a GUI similar to modeling, enabling rapid experimental design planning and optimization.
Second, it supports phase change material (PCM) thermal analysis. Transient thermal analysis of phase change materials is possible based on latent heat, specific heat, and melting temperature.
Third, PCB designs can be imported into FloTHERM using ODB++, the PCB industry standard data format. Through support for blind vias and buried vias, more accurate thermal transfer analysis within the PCB is possible.
Finally, the enhanced parallel solver provides faster and more scalable results across various environments.
This webinar includes a demonstration of calibration work for IGBT FloTHERM simulation models using T3Ster measurement results. Through this, improvement in simulation model accuracy and reliability is possible.
We hope you will participate in this webinar and find it to be a valuable session. Thank you.
댓글
- 27 Comments
- 조*수 (2018-03-27 오전 10:32:13)
- 좋은 세미나 기대 합니다
- 김*태 (2018-03-27 오전 10:22:56)
- 좋은 세미나 기대해 봅니다.~
- 정*균 (2018-03-27 오전 10:03:44)
- 좋은 세미나 기대됩니다~^^
- 이*구 (2018-03-27 오전 8:51:28)
- 업무에 도움되는 자료 잘 활용하겠습니다!
- 최*호 (2018-03-26 오후 1:07:24)
- 항상 감사합니다. 세미나 기대합니다~ ^^
- 정*성 (2018-03-26 오전 8:20:33)
- PCB설계 ~ 방열 해석의 플로우 및 실측 vs 정합성 검증까지의 내용도 포함 되어있으면 좋겠습니다.
- 사**대 (2018-03-26 오전 8:15:57)
- PCB 설계에 있어 양산시 해당 오류를 줄일 수 있는 좋은 세미나 감사드려요
- (2018-03-23 오후 5:23:25)
- 세미나 잘 시청하겠습니다.
- 김*남 (2018-03-21 오전 11:03:23)
- 세미나 기대 되네요~
- 강*우 (2018-03-21 오전 10:31:17)
- 기존 PCB 설계에 있어 양산시 해당 오류를 줄일 수 있는 좋은 방안입니다.