e4ds news February Monthly Briefing

Our monthly briefing introducing major articles from e4ds news will be held on Friday, February 24, 2023 at 10:30 AM for the 14th session.

We appreciate your participation.

 

Friday, February 24, 2023
[Top Article of February] Full-scale investment in analog and power semiconductors underway
[Featured Articles of February] “U.S. to Continue Semiconductor Export Controls Waiver Against China” Facial recognition authentication surges since 2020 Semiconductor technology accelerates bio convergence…long-chip 1 trillion won market arrives
[Kim Ye-ji's Insight] Record performance by three telecom companies
[Focus] “No smartphones in 15 years” “Fabless companies must target the edge” [Monthly Planning - Developer Reality③] Population cliff era calls for global developer workforce
[Person of January] Park Dong-ju, Chair of 5G Forum Ecosystem Strategy Committee
[Technology Interview] Jang Byung-nam, CEO of CodeJu—“Implementing connected cars via LTE networks” Choi Hyun-woo, ST Manager—“ST motor solutions allow diverse combination configurations” Lee Chang-hee, Infineon Director—“Magnetic induction wireless charging devices must comply with Qi 1.3 standard”
[Sung Yoo-chang's Grand Prix] Electromagnetic Wave Society winter academic conference
[Special Feature - Semicon Korea 2023] Semicon Korea 2023 opens, breakthrough semiconductor slump with technology “Semiconductors and economy face bottleneck in 2023” “Hybrid bonding draws significant attention”…global supply chain capabilities concentrate Kim Woo-kyou, CEO of Merck Korea—“Merck will continue investment with confidence in semiconductor's bright future” Han Jung-wook, CEO of Wonik Materials—“Maintain customer trust through stable material supply” Yeo Moon-won, CEO of Mico Ceramics—“Reduced revision time sets foundation for world second place” Seo In-su, Chairman of Sungdo E&G—“Break through difficult semiconductor investment environment with technological capability”
[February Webinars] AI Tech Concert - Computer Vision Applications: AI Fire Detection System Innovation Through SPE (Single Pair Ethernet) - Microchip SPE Solutions LTE CAT-M1, Azure IoT Central for Connected Car Concept Development Optimal Test Solution for TMT4 PCIe GEN3,4 TX, RX Performance Verification
[March Webinars] Collaborative Robot Application Guide - Machine Tending with Cobots ST's New High-Performance MCU, STM32H5 LoRa® Solutions: Long-Range Wireless Communication Technology and Applications in Various IoT Fields
[Key Articles of February] “Digital Twin improves construction site safety management and productivity” Vice Chairman Park Jung-ho: “AI chatbot becomes new killer application for semiconductor demand” “Fabless companies must target the edge” Domestic EV sales overtake diesel vehicles Global EV subsidies cut, China abolishes, U.S. freezes “Daegu possesses sufficient capability to develop motor-specialized industrial complex”
[New Products & IT News] “IBM commits fully to AI and hybrid cloud” Applied detects defects below 1 nanometer with CFE technology Dell launches 'Dell PowerEdge' server based on 4th-generation Intel Xeon Schneider: “Digitalization + Electrification = Sustainability” ST releases vehicle high-side driver with expanded scalability Infineon top-side cooling package registered as JEDEC standard

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