XENSIV™ High-Performance MEMS Microphone and Global Innovation Cases

Upgrade your audio experience to the next level by combining studio quality with exceptional precision using XENSIV™ MEMS micro audio. Based on world-leading best-selling components, featuring ANC, array-based beamforming, and source separation capabilities for immersive user experience, it supports audio zoom, multi-user, and far-field audio capture even in multi-room and noisy environments. You can build premium audio systems (smartphones, headsets, TWS, PCs, etc.) that deliver high SNR, low THD, and high AOP.

• Class-leading SNR and sensitivity
• High acoustic overload point (AOP)
• Environmental robustness
• Low-latency wideband audio signal
• Audio pattern detection
• Selectable power modes
• Far-field, low-volume audio pickup
• Clear audio signal at maximum SPL
• Ultra-low power consumption
• Clean audio for advanced processing
• Compact package size

XENSIV™ MEMS Microphones Delivering Outstanding Precision and Quality
Infineon's XENSIV™ MEMS microphones are designed to capture audio signals with high precision and quality, featuring low self-noise (high SNR), very low distortion (THD) even at high sound pressure levels (SPL), precise phase and sensitivity matching between components, flat frequency response with low-frequency rolloff (LFRO), and low group delay. With various low-power options and an ultra-compact package lineup, Infineon's XENSIV™ MEMS microphones are widely applied across diverse global applications requiring superior audio capture capabilities.
 
Technology-Leading XENSIV™ MEMS Microphones
MEMS microphones use an electrically charged backplate and membrane to form a capacitive acoustic transducer. The flexible membrane moves proportionally to the amplitude and frequency of incoming sound waves. The resulting voltage changes are measured, processed, and output by the built-in analog or digital ASIC. Infineon products employ two major MEMS technologies: single backplate technology (SBP) and sealed dual membrane (SDM).
 
SDM Technology
Sealed Dual Membrane (SDM) is Infineon's innovative MEMS microphone technology that uses two membranes and a charged stator to generate a sealed low-pressure cavity and differential output signal. This architecture implements ultra-high-quality signal-to-noise ratio (SNR) of up to 75dB SNR and very low distortion, while providing a high dust and water resistance rating (IP57). With Infineon's SDM technology, class-leading acoustic performance can be achieved.
 
SBP Technology
Single Backplate Technology (SBP) provides the best cost-performance efficiency in its class in a compact package with simplicity and robustness. It features high performance delivering up to 69dB SNR and dust and water resistance rating of IP57, providing strong protection against various external environmental factors.
 
Webinar Highlights
- Introduction to XENSIV MEMS Mic portfolio
- Product-specific features, key performance, application examples, and innovative user experience introduction
- Introduction to XENSIV MEMS Mic application test kit