ADI uModule & uSLIC: Simplification of Power Design

New Selection Criteria for Simplified Power Design

High-Integration Power Solutions Completed with ADI uModule™ and uSLIC™
 

As highly integrated systems and high-power-density designs become commonplace, power design is becoming increasingly complex.
This webinar focuses on Analog Devices (ADI) uModule™ and uSLIC™ power solutions, introducing power design simplification strategies that account for package structure, efficiency, thermal and EMI performance, and board area.
 

---

💡 Webinar Key Topics

1. Why Power Design is Becoming Difficult
   – Increasing power design complexity in highly integrated and high-output systems
   – Trade-offs between efficiency, thermal, EMI, and board area
    

2. uModule™ vs. uSLIC™ – Understanding Structural Differences
   – Technical differences between fully integrated uModule™ and integrated package uSLIC™
   – Comparison of design difficulty and implementation approaches from an internal architecture perspective
    

3. Selection Criteria from a Performance Perspective
   – Comparison of power efficiency, thermal characteristics, and EMI performance
   – Guide for selecting optimal solutions based on system requirements
    

4. Board Area and Design Productivity Improvement Strategies
   – Layout simplification through component count reduction
   – Methods to shorten development time and minimize design risk
    

---

👀 Recommended For

 

✔️ Power and hardware engineers feeling development burden from highly integrated power design
✔️ System design managers who must simultaneously consider efficiency, thermal, and EMI performance
✔️ Project managers requiring board area reduction and shortened development schedules
✔️ Developers who want to clearly understand the differences between uModule™ and uSLIC™
 

---

Power design no longer has to be complex.
In this webinar, discover clear selection criteria for uModule™ and uSLIC™ and practical design insights.