‘3D 패키징’ 키워드 기사 3 articles
Applied Materials and Intel Collaborate on AI Semiconductor Technology Development
Applied Materials and Intel are collaborating on the development of advanced semiconductor technology for AI computing. By combining the Silicon Valle…
2026.10.07 by 배종인 기자
Henkel to Unveil Advanced Packaging Materials for AI and HBM at SEDEX 2026
Henkel will showcase semiconductor high-density packaging solutions for the AI and HBM era at SEDEX 2026. Through advanced materials such as underfill…
2026.10.06 by 배종인 기자
Applied Materials and SK Hynix Partner to Develop Next-Generation AI Memory
As competition intensifies in the development of high-performance memory, a critical component in the AI era, Applied Materials and SK Hynix have join…
2026.03.11 by 배종인 기자