[OSW 2026]"The Key to AI Era is Connection, Not Computation; PIC and CPO on the Rise"
The Optical Science and Semiconductor Workshop 2026 (OSW 2026), held from the 17th to 18th at the Suwon Convention Center, conveyed a message that in …
2026.09.18 by 배종인 기자
EVG Supports Resolution of CPO Manufacturing Challenges for AI Data Centers
As the importance of CPO (Co-Packaged Optics), a high-bandwidth and low-power optical interconnect technology, grows with expanding AI data center dem…
2026.09.02 by 배종인 기자
Applied Materials Targets 'Memory Wall' in AI Era...Presents Solutions Across D-RAM, HBM, and Packaging
In the artificial intelligence (AI) era, semiconductor industry competition hinges on 'data movement' rather than 'computation'. As AI models grow lar…
2026.08.31 by 배종인 기자
SK Hynix Unveils Next-Generation AI Infrastructure Blueprint Based on Optical Interconnect
SK Hynix has disclosed its CPO (Co-Packaged Optics) roadmap, a core technology for next-generation AI infrastructure, to Nature Electronics. To addres…
2026.08.21 by 배종인 기자
The Future Opened by the Convergence of Light and Semiconductors…'Optical Science and Optical Semiconductor Workshop 2026' Held in Suwon
The 'Optical Science and Optical Semiconductor Workshop 2026' addressing light and semiconductor convergence technologies will be held on September 17…
2026.08.21 by 배종인 기자
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The Era of 1 Million GPUs: Bottlenecks Are 'Wiring,' Not Computation… CPOs Are Changing the Data Center Landscape
AI data centers face data movement as a bottleneck rather than GPU computation. CPO (Co-Packaged Optics), which packages switch ASICs and optical engi…
2026.07.31 by 배종인 기자
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The Future of AI Data Centers, Why CPO Now?… e4ds EEWebinar to be held on July 21
e4ds news will host a webinar on July 21st through the e4ds EEWebinar titled 'Why CPO Now? The Future of Data Center Optical Interconnects'. Advisor I…
2026.07.08 by 배종인 기자