Intel Unveils GPU D-Series and Xeon-Based AI Infrastructure at OCP Summit
Intel has unveiled a heterogeneous AI infrastructure strategy at the OCP Global Summit to address the proliferation of generative AI. The GPU D-Series…
2026.10.13 by 배종인 기자
Applied Materials and Intel Collaborate on AI Semiconductor Technology Development
Applied Materials and Intel are collaborating on the development of advanced semiconductor technology for AI computing. By combining the Silicon Valle…
2026.10.07 by 배종인 기자
Intel Unveils Three Agentic AI Architectures at Hot Chips 2026
Intel has unveiled three new architectures at Hot Chips 2026 to support agentic AI workloads. Diamond Rapids, Crescent Island, and Wildcat Lake are al…
2026.08.25 by 배종인 기자
Intel Accelerates Advanced Packaging Technology at New Mexico Fab
Intel is accelerating the development of advanced packaging technologies including Foveros, EMIB, and EMIB-T at its New Mexico Fab 9. This effort aims…
2026.07.30 by 배종인 기자
Intel Hosts Korea Representative Selection for AI Global Impact Festival
Intel Korea will officially hold the Korean representative selection preliminary for the AI Global Impact Festival on July 21st. This is a competition…
2026.07.21 by 배종인 기자