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AMD, “Robotics: ‘Response over Speed’ – Distributed AI and Heterogeneous Semiconductors Key”
AMD Systems Design Specialist Jung-hoon Jeong presented the architecture of robotic systems and the appropriate semiconductor architecture direction a…
2026.06.11 by 배종인 기자
AMD Emphasizes 'Lab-Level CPU Performance' for Agentic AI… Presents EPYC-Based Infrastructure
AMD has provided guidance on the direction of data center infrastructure changes resulting from the spread of agentic AI. It emphasized that moving be…
2026.06.11 by 배종인 기자
AMD, “Strengthening CPU-Centric Orchestration Is Essential for Spread of Agentic AI”
AMD recently stated through its official blog that the importance of CPUs is increasing as AI systems evolve to be based on agentic AI.
2026.06.08 by 배종인 기자
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SKT and NVIDIA Collaborate on AI Cloud… First Launch in Korea in 2027
SK Telecom is embarking on the construction of an AI-dedicated cloud infrastructure in collaboration with Nvidia. The two companies plan to first esta…
2026.06.08 by 배종인 기자
Nota Improves AI PC LLM Efficiency with GPU and NPU Distributed Inference
Nota has implemented technology that leverages both GPU and NPU together on AI PCs to improve large language model (LLM) inference efficiency. On Inte…
2026.06.04 by 명세환 기자
Chairman Chey Tae-won Strengthens AI Cooperation with Nvidia
SK Group Chairman Chey Tae-won attended 'GTC Taipei 2026' held in Taiwan to review Nvidia's AI technology roadmap and examine cooperation directions. …
2026.06.02 by 배종인 기자
Siemens Launches Simcenter PhysicsAI to Accelerate CFD Design Exploration with AI
Siemens has launched 'Simcenter PhysicsAI,' which supports design exploration using an AI model trained on CFD simulation results. Provided as an add-…
2026.06.02 by 배종인 기자
Prime Mars to Mass Produce CXL-Based 'JBOM' in Second Half... Addressing AI Memory Bottleneck
PrimeMass will begin mass production of 'JBOM,' a CXL-based memory expansion solution targeting the memory capacity limitations of AI data centers, fr…
2026.05.28 by 배종인 기자
The Era of Agent AI: The 'Sidelined CPU' Returns… Shift in Inference Reshapes the Semiconductor Landscape
Recently, as the center of gravity in the AI industry has shifted from training to inference, and further with the rise of Agentic AI, CPUs—which had …
2026.04.30 by 배종인 기자
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SK Hynix Wins First IEEE Corporate Innovation Award… Recognized for HBM Technology Achievements
SK Hynix has received the Corporate Innovation Award at the '2026 IEEE Awards'. The award was primarily attributed to the company's contribution to th…
2026.04.27 by 배종인 기자
Global AI Chipset Market to Reach $1 Trillion by 2035
As artificial intelligence (AI) technology spreads across industries, the AI chipset market, which serves as the core infrastructure supporting this e…
2026.04.09 by 배종인 기자
KERI Supports Data and GPU Infrastructure for Medical Device Companies in Changwon
The Korea Electrotechnology Research Institute (KERI) and the National Information Society Agency (NIA) have begun collaboration to foster the medical…
2026.04.01 by 명세환 기자
ST Expands 800VDC Power Solutions for AI Data Centers with NVIDIA… Adds 12V and 6V Architectures
STMicroelectronics has expanded its 800VDC power conversion portfolio for AI data centers in collaboration with NVIDIA. The newly unveiled 800VDC-12V …
2026.03.24 by 배종인 기자
Samsung Electronics and AMD Join Forces on HBM4 and Foundry Services
Samsung Electronics and AMD are significantly expanding their cooperation to strengthen next-generation artificial intelligence (AI) infrastructure co…
2026.03.18 by 배종인 기자
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Congatec Extends Performance of AMD Ryzen AI-Based COM Modules… Expanding Edge AI Design Flexibility
Congatec has enhanced the performance and scalability of the 'conga-TCRP1', a COM Express module based on AMD Ryzen AI Embedded P100 series. The modul…
2026.03.17 by 명세환 기자