Henkel to Unveil Advanced Packaging Materials for AI and HBM at SEDEX 2026
Henkel will showcase semiconductor high-density packaging solutions for the AI and HBM era at SEDEX 2026. Through advanced materials such as underfill…
2026.10.06 by 배종인 기자
Intel Accelerates Advanced Packaging Technology at New Mexico Fab
Intel is accelerating the development of advanced packaging technologies including Foveros, EMIB, and EMIB-T at its New Mexico Fab 9. This effort aims…
2026.07.30 by 배종인 기자
"Automotive Semiconductor Microfabrication 'Cost Paradox' Solved with 'Chiplets'"
Park Jae-hong, CEO of Bos Semiconductor, presented on "The Future of Automotive and Physical AI Semiconductors" at the "High-Functionality Semiconduct…
2026.04.27 by 배종인 기자
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Memory expansion through the combination of chiplet SoC, DRAM, and system integration technology
Samsung Electronics, the Electronics and Telecommunications Research Institute (ETRI), and fabless company Primetech have launched joint development o…
2026.04.06 by 배종인 기자
AMD Unveils Ryzen 9 9950X3D2 with Dual 3D V-Cache… Targeting Development and Creative Work
AMD has unveiled the Ryzen 9 9950X3D2, a high-performance desktop processor for developers and creators. This product is the first desktop processor t…
2026.03.27 by 명세환 기자
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Arm Announces Chiplet System Architecture Public Specification
Arm, which is leading the standardization of chiplets, has announced the first public specification of CSA. The industry expects this will significant…
2025.02.03 by 명세환 기자
Intel Implements Industry's First Fully Integrated Optical I/O Chiplet
Intel has achieved an innovative milestone by implementing the industry's first fully integrated optical input/output (I/O) chiplet for scalable AI in…
2024.06.27 by 배종인 기자
Japan begins developing chiplet-based automotive semiconductors
Japan's Advanced SoC Technology Research Association for Automobiles (hereinafter ASRA) was selected as a consignee for "Research and Development of A…
2024.04.16 by 성유창 기자