전체기사188건
DeepX Unveils DX-M1 with Local Partner at Japan's DX Week 2026
DeepX participated in DX Week 2026, held from April 8th to 10th at Tokyo Big Sight in Japan, and showcased its AI semiconductor 'DX-M1' alongside loca…
2026.04.13 by 배종인 기자
Intel and Google Accelerate Construction of Large-Scale AI Systems Combining CPUs and IPUs
Intel and Google are pursuing a strategic partnership that strengthens the roles of CPUs and custom-built IPUs (Infrastructure Processing Units) to ef…
2026.04.10 by 배종인 기자
Global AI Chipset Market to Reach $1 Trillion by 2035
As artificial intelligence (AI) technology spreads across industries, the AI chipset market, which serves as the core infrastructure supporting this e…
2026.04.09 by 배종인 기자
Semiconductor Industry Steps Up to Respond to Global Energy Crisis, Begins Full-Scale Implementation of Power Conservation
As global energy supply instability persists, Korea's semiconductor industry is initiating voluntary energy reduction activities in line with the gove…
2026.04.09 by 배종인 기자
SEMI “Global Semiconductor Equipment Sales to Increase by 15% by 2025”
SEMI announced that global semiconductor equipment sales in 2025 reached $135.1 billion, representing a 15% increase compared to the previous year. Th…
2026.04.08 by 배종인 기자
Intel Strengthens APJ Leadership… Appoints Santosh Viswanathan as General Manager
Intel has appointed Santhosh Viswanathan, who oversaw operations in India, to the position of APJ (Asia Pacific and Japan) regional head to strengthen…
2026.04.08 by 배종인 기자
Memory expansion through the combination of chiplet SoC, DRAM, and system integration technology
Samsung Electronics, the Electronics and Telecommunications Research Institute (ETRI), and fabless company Primetech have launched joint development o…
2026.04.06 by 배종인 기자
Samsung Electronics and AMD Join Forces on HBM4 and Foundry Services
Samsung Electronics and AMD are significantly expanding their cooperation to strengthen next-generation artificial intelligence (AI) infrastructure co…
2026.03.18 by 배종인 기자
Samsung Electronics Unveils Next-Generation HBM4E at NVIDIA GTC… Highlighting Competitiveness as an AI Memory 'Total Solution'
Samsung Electronics participated in Nvidia GTC 2026, showcasing a memory integration strategy encompassing next-generation high-bandwidth memory (HBM)…
2026.03.17 by 배종인 기자
Semiconductor Competitiveness in the AI Era Shifts to 'Execution Speed and Yield-Centric Capabilities'
The investment paradigm in the semiconductor industry is shifting due to expanding AI demand. AI is driving investment focused on memory and advanced …
2026.02.23 by 명세환 기자
SK Hynix Unleashes Innovations, Including HBM4, LPDDR6, and 321-Layer QLC
SK Hynix showcased its position as a leading provider of differentiated memory solutions tailored to AI-era demands at CES 2026, unveiling AI-optimize…
2026.01.06 by 명세환 기자
SK Hynix Wins Two GSA Awards 2025 Awards
SK Hynix won both the "Best Financial Management Semiconductor Company Award" and the "Excellence Asia Pacific Semiconductor Company Award" at the 'GS…
2025.12.09 by 명세환 기자
SK Expands AI Ecosystem with NVIDIA, Including HBM4 and AI Factory
SK Group is partnering with NVIDIA to build a "Manufacturing AI Cloud" that will lead the digital transformation of Korea's domestic manufacturing eco…
2025.11.03 by 명세환 기자
Samsung Electronics and NVIDIA's AI semiconductor alliance evolves, with HBM4 supply on the horizon.
Samsung Electronics is expanding its AI factory infrastructure by adopting over 50,000 GPUs from NVIDIA, the world's largest AI semiconductor company,…
2025.11.03 by 배종인 기자
Latent Inference Transformer Model Emerges, HBM Goes High, and PIM Arrives
The emergence of DeepSeek is creating cracks in the existing landscape. As new transformer models that can reduce HBM dependency in the AI hardware ma…
2025.02.17 by 권신혁 기자


