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RISC-V Market to Experience High Growth Driven by Spread of Open ISAs… Projected to Reach $4.8 Billion by 2032
RISC-V, an open-source instruction set architecture (ISA), is rapidly expanding its influence in the semiconductor design ecosystem. Based on its roya…
2026.05.28 by 배종인 기자
Samsung Electronics Signs 2026 Wage Agreement… Labor-Management 'Tentative Agreement' Approved, Final Settlement
Samsung Electronics has concluded wage negotiations with its labor union and signed a 2026 wage agreement. The agreement reached after prolonged negot…
2026.05.27 by 배종인 기자
Seorin C&I Launches Leadtek RTX PRO Blackwell Graphics Cards in Korea
Seourin C&I has launched three types of Leadtek's NVIDIA Blackwell-based graphics cards for workstations in the domestic market. The new products are …
2026.05.27 by 명세환 기자
SEMI, “Glass Core Substrate Market Growing at 67.2% Annual Rate”
SEMI has jointly published a report on the glass core substrate market and development trends with GNC. The report analyzes that as demand for advance…
2026.05.27 by 배종인 기자
Schneider Electric Hosts 'Innovation Day' for Semiconductor Industry
Schneider Electric Korea is hosting an "Innovation Day" event for the semiconductor industry and equipment manufacturers. The event has been organized…
2026.05.26 by 배종인 기자
Lam Research Establishes Salzburg Panel Innovation Center… Aims to Transition to Mass Production of AI Packaging
Lam Research has established a Panel Innovation Center in Salzburg, Austria. The facility is an R&D center built on panel-level wet process technology…
2026.05.26 by 배종인 기자
Synology Launches Enterprise NVMe Storage 'PAS7700'
Synology has launched the 'PAS7700', its first active-active all-flash NVMe enterprise storage system. The PAS7700 targets AI, virtualization, and lar…
2026.05.26 by 명세환 기자
DeepX Unveils Physical AI Ecosystem with Over 30 Partners at Computex
DeepX will unveil physical AI solutions with approximately 30 global partners at Computex Taipei 2026. Since winning the InnoVEX Innovation Award in 2…
2026.05.26 by 배종인 기자
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SK Hynix Unveils HBM Internal Cooling Technology… AI Response to Memory Heat
SK Hynix has unveiled 'iHBM' technology, which incorporates cooling elements inside the HBM package. This technology forms a separate heat dissipation…
2026.05.26 by 배종인 기자
Measurement in the HBM era: The key is whether the measurement changes the signal.
According to Mohamed Hafed, CEO of Introspect Technology, who presented next-generation DDR/LPDDR memory analysis solution (Introspect) at the e4ds & …
2026.05.22 by 배종인 기자
AMD Unveils Local AI Development Platform… Expands Enterprise AI PC Product Line
AMD has unveiled a local AI development platform and enterprise AI PC processor that enable running large-scale AI models in PC environments. The Ryze…
2026.05.21 by 명세환 기자
Broadcom Joins Applied EPIC… Pursuing AI Packaging Collaboration
Applied Materials announced Broadcom as an EPIC platform partner and will collaborate on developing advanced packaging technologies for AI systems. Br…
2026.05.21 by 배종인 기자
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AMD Unveils 'EPYC 8005' Server CPU... Addressing Edge and Telecommunications Environments
AMD has unveiled its 'EPYC 8005' server CPU, targeting edge, telecommunications, and cloud storage environments.
2026.05.20 by 배종인 기자
ACM Ships First SiCN Deposition Equipment… Expanding Support for Advanced BEOL and Packaging Processes
ACM Research shipped its first PECVD SiCN system targeting advanced semiconductor back-end-of-line and packaging processes to a major semiconductor ma…
2026.05.20 by 명세환 기자
UNIST Develops Water-Reactive Luminescent Material That Changes Brightness
UNIST researchers have developed an optical material based on upconversion nanoparticles whose luminescence intensity varies with moisture content. Th…
2026.05.20 by 배종인 기자