인텔이 NPU를 장착한 초저전력 프로세서로 인공지능(AI) 결과물을 누구나 산출할 수 있는 ‘인텔ⓡ 코어™ Ultra 노트북용 프로세서 제품군’을 출시하며, AI PC 시대를 열었다. 또한 모든 코어에 AI 가속기를 내장해 총소유비용(TCO)을 절감한 5세대 인텔ⓡ 제온ⓡ 프로세서 제품군(The 5th Gen Intelⓡ Xeonⓡ processor family)도 출시하며, 업계 최상의 인텔 AI 포트폴리오를 확장했다.
▲Intel Korea President Kwon Myung-sook personally introduces Intel 4 process-based wafers at the Intel AI Everywhere media conference.
Core Ultra, Intel 4-process tile-type CPU/NPU/GPU layout
5th Generation Xeon, 64 Cores, Level Cache, 3x More Than Previous, 77% TCO Reduction
Intel has opened the era of AI PCs by launching the 'Intel® Core™ Ultra notebook processor family', which allows anyone to produce artificial intelligence (AI) results with ultra-low-power processors equipped with NPUs. We also expanded Intel’s industry-leading AI portfolio with the launch of the 5th Gen Intel® Xeon® processor family, which integrates AI accelerators into every core to reduce total cost of ownership (TCO).
On the 18th, Intel held a press conference at the Federation of Korean Industries building and introduced the Intel® Core™ Ultra mobile processor family and the 5th Gen Intel® Xeon® processor family, which support the implementation of AI solutions anytime, anywhere.
In her congratulatory speech, Intel Korea President Kwon Myung-sook said, “As the demand for digital transformation across all industries is intensifying, the proportion of the digital economy, which currently accounts for about 15% of GDP, will increase to about 25% in the next 10 years due to the acceleration of AI innovation, and AI will accelerate this and eventually grow to one-third of GDP.” She added, “Intel will support hardware and software solutions that provide the best efficient AI performance, helping customers seamlessly build and expand AI from the cloud and network to PCs and edge infrastructure.”

▲(From left) Intel® Core™ Ultra notebook processor, Intel 4 process wafer, 5th generation Intel® Xeon® processor
The 5th generation Intel Xeon processor announced by Executive Director Seung-Joo Na supports up to 64 cores per CPU and up to the last The level cache is almost three times larger than the previous generation.
It also provides eight DDR5 channels per CPU, supports DDR5 at up to 5,600 megatransfers per second (MT/s), and increases inter-socket bandwidth through Intel UPI 2.0 to provide up to 20 gigatransfers per second (GT/s).
It supports AI acceleration across all cores to solve demanding end-to-end AI workloads, such as increasing inference performance by up to 42% and maintaining latency under 100 milliseconds on large language models (LLMs) with up to 20 billion parameters, without requiring customers to add separate external accelerators.
Compared to previous Xeon generations, it can improve average performance gains for general-purpose computing by up to 21% across a wide range of customer workloads and increase average performance per watt by up to 36%. Customers who typically upgrade every five years, and even those upgrading from older generations, can experience TCO savings of up to 77%.

▲5th generation Intel® Xeon® processor
Intel Core Ultra, announced by Executive Vice President Choi Won-hyeok, is the first processor built on Intel 4 process technology and is the processor with the greatest architectural change in Intel's 40-year history.
It provides up to 16 cores (6 P-cores, 8 E-cores, 2 LP E-cores), 22 threads, and next-generation Intel® Thread Director for optimal workload scheduling.
It supports a maximum turbo clock of up to 5.1GHz and a maximum memory capacity of up to 64GB LP5/x and up to 96GB DDR5.
It features leading wireless features including integrated Intel® Wi-Fi 6E (Gig+) and discrete Intel® Wi-Fi 77 (5 Gig) support, and Intel® Killer™ software that intelligently optimizes connectivity and prioritizes network traffic for gamer and creator applications.
Intel® Bluetooth® LE Audio delivers a low-power, immersive, high-fidelity PC audio experience, and supports new Bluetooth® Auracast™ capabilities for easy tuning of broadcast audio, personal audio sharing, and access to hearing aids and new assistive listening services.
Thunderbolt™ 4 lets you connect your PC to multiple 4K monitors, high-speed storage, and other accessories with incredible connection speeds of up to 40Gbps.
It also supports the OpenVINO™ toolkit, which automatically detects devices and minimizes code changes.
The CPU is designed in a tile format.
The new P-core (Performance-core) architecture delivers improved instructions per cycle (IPC), while the new E-core (Efficient-core) and low-power E-core (LP E-core) deliver scalable multi-threaded performance up to 11 percent higher than the competition, delivering the ultimate CPU computing performance for ultra-thin PCs.
The built-in Intel® Arc™ GPU3 features up to eight Xe cores, AI-based Xe Super Sampling (XeSS), DX12 Ultimate support, and up to 2x the graphics performance of the previous generation. The GPU includes support for the latest graphics features, including hardware-accelerated ray tracing, mesh shading, AV1 encoding and decoding, HDMI 2.1, and DisplayPort 2.1 20G.
The latest Intel NPU, dubbed Intel® AI Boost, is specifically designed to handle long-running AI workloads at low power, complementing AI processing across both the CPU and GPU and delivering up to 2.5x better power efficiency than the previous generation.
Meanwhile, Intel's domestic partners attended this event and introduced their technologies and new products, drawing much attention.
Samsung Electronics positively evaluated the impact of the launch of Intel's 5th generation Xeon processor and Intel Core Ultra processor on the memory market and emphasized its continued close cooperation with Intel, expressing expectations for the market next year.
In addition, Samsung Electronics introduced the 'Samsung Galaxy Book 4 Series' and LG Electronics introduced the 'LG Gram 16' as the world's first AI PC product line equipped with the Intel Core Ultra processor. Intel demonstrated AI PC use cases with this product.