Intel announced at CES on the 10th (local time) that it plans to lead its AI Everywhere strategy for the automotive market, including the acquisition of Silicon Mobility, a fabless silicon and software company specializing in SoCs for intelligent EV power management. Intel also announced a new family of AI-based software-defined vehicle SoCs (systems on chips) and announced that Zeekr will be the first OEM to introduce new products to provide new generative AI-based in-cabin experiences for next-generation vehicles.

“Intel is taking a ‘whole vehicle’ approach to solving the industry’s toughest challenges. Applying innovative AI solutions across vehicle platforms will help navigate the industry’s transition to EV,” said Jack Weast, vice president and general manager of Intel Automotive. “The Silicon Mobility acquisition addresses the industry’s critical power management needs while also supporting Intel’s sustainability goals.”

The EV transition, including customer demand for in-vehicle experiences, is accelerating Intel’s strategy for SDV implementation. Intel announced its commitment to deliver the industry’s first open UCIe-based chiplet platform for SDV. Intel plans to work with imec to deliver packaging technology that meets the stringent quality and reliability requirements of the automotive industry. Intel will also lead the industry in establishing new international standards for EV power management.

Intel SoCs are currently installed in more than 50 million vehicles, powering infotainment, displays, and digital audio clusters.

Intel also acquired a silicon mobility fabless company to unlock a sustainable electric vehicle future.

Silicon Mobility SAS, a portfolio company of Cipio Partners and Capital-E, is a fabless automotive silicon and software company that designs, develops and deploys EV energy management SoCs.

Silicon Mobility’s SoCs feature industry-leading accelerators specifically built for energy transfer, and are designed with advanced software algorithms to significantly improve vehicle energy efficiency. Silicon Mobility’s technology portfolio extends Intel’s reach beyond high-performance computing to intelligent, programmable power devices inside the vehicle. The acquisition is subject to regulatory approvals.

■ Intel's open platform to implement AI PC experience in vehicles

The new family of AI-enhanced SDV SoCs addresses critical industry requirements for power and performance scalability. The SoC family features AI acceleration to support the most demanding in-vehicle AI use cases, such as driver and passenger monitoring, on Intel’s AI PC roadmap.

“Intel’s AI-enhanced SDV SoC combines the best of AI PC and Intel data center technologies to support a true software-defined vehicle architecture,” said Jack Wist, vice president of automotive.

■ Ziker, Intel-based generative AI experience introduced to EV

Zeek, the electric vehicle brand of China's Geely Automobile, will be the first OEM to feature Intel's new SDV SoC in its next-generation electric vehicles.

“With the full compatibility of Intel systems and the acceleration of Intel AI, Zeeker can continue to expand and upgrade its services to meet customer needs by enabling next-generation experiences such as AI-based voice assistants,” said Andy An, Chairman of Zhejiang Jieli Holding Group and CEO of Zeeker.

■ ‘Open Standards’ for Industry Success

Intel announced that it is forming an expert committee with the Society of Automotive Engineers (SAE International) under Intel to support vehicle platform power management automotive standards to enable a rapid and smooth transition to sustainable SDVs, including electric vehicles.

Inspired by the power management technologies proven in the ACPI standard in the PC industry, the new SAE standard plans to adopt, improve, and accelerate advanced PC power management concepts to help make all EVs more energy efficient and sustainable.

The current committee consists of Stellantis, HERE and MPS (Monolithic PowerThe committee is comprised of industry leaders such as IBM, IBM Systems, and others, and is accepting applications for additional committee participation with the goal of sharing the first draft of the standard within 12 to 18 months.

■ All-out effort in developing an open automotive chiplet platform

Additionally, Intel has announced its intention to collaborate with the R&D hub of semiconductor research institute imec to ensure that its advanced chiplet packaging technology can be utilized in the automotive sector, which has stringent quality and reliability requirements.

Intel's move could be interpreted as an effort by automotive suppliers to become the first to allow third-party chiplets to be integrated into automaker components.

This gives OEMs the freedom to choose to adopt Intel’s custom chiplets, which can help reduce SoC cost burden. In addition, the flexibility to mix and match chiplets allows for vendor lock-in and more scalable software-defined architectures.