ACM Research, a leading provider of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, is improving process efficiency and reliability in copper-related applications with a new double-sided bevel etching system that supports high-precision characterization on large panels.

ACM announced today the launch of its Ultra C bev-p panel bevel etch equipment for fan-out panel level packaging (FOPLP) applications.

The new equipment is specifically designed for bevel etching and cleaning in copper-related processes, and can handle both front and back panel bevel etching within a single system, improving process efficiency and product reliability.

The Ultra C bev-p tool is a key element of the FOPLP process and utilizes a wet etching technique specifically designed for bevel etching and copper residue removal. This process is critical to ensuring long-term device reliability by preventing electrical shorts, minimizing contamination risks, and maintaining the integrity of subsequent processing steps. Key to the tool’s effectiveness is ACM’s patented technology that addresses the unique challenges of square panel substrates.

Unlike conventional round wafers, ACM’s innovative design ensures precise bevel removal process confined to the bevel area even on curved panels. These technological advances are essential to maintaining the integrity of the etching process and achieving the high performance and reliability required by advanced semiconductor technologies.

Key features of Ultra C bev-p equipment include: It is specifically designed for panel substrates, providing compatibility with organic materials, glass materials and bonded panels. It efficiently processes both the front and back of the panel, and can process 510 x 515 millimeter and 600 x 600 millimeter panels with thicknesses from 0.5 millimeter to 3 millimeters. The equipment can handle panel warpage up to 10 millimeters, ensuring optimal process conditions.

Equipped with a single robot for safe and precise panel handling and transport for advanced panel processing.

For effective copper removal, use Diluted Sulfuric Acid and Hydrogen Peroxide (DSP), a mixture of deionized (DI) water, sulfuric acid, and hydrogen peroxide. It also includes DI water for rinsing and N2 for final drying to keep surfaces clean and dry.

Capable of operating up to six processing chambers, the Ultra C bev-p can process 40 panels per hour (PPH), making it highly efficient for mass production.

The system offers bevel control accuracy of ±0.2 millimeters and an unrivaled control range of 0 to 20 millimeters. It is also designed with a mean time between failures (MTBF) of 500 hours and an uptime of 95%, ensuring excellent reliability, consistent performance, and operational efficiency.