As the world's largest consumer electronics show, CES 2025, approaches, the latest technologies and products from domestic semiconductor companies are expected to be unveiled in large numbers. SK Hynix is expected to unveil a blueprint for advanced memory solutions including HBM and PIM, raising expectations.

SK Hynix announced on the 3rd that it will participate in 'CES 2025' held in Las Vegas, USA from the 7th to the 10th (local time) and showcase its innovative AI memory technology.

SK Hynix executives, including CEO Kwak No-jeong, AI Infrastructure President Kim Joo-sun, and Development Chief President Ahn Hyeon, will attend the event.

SK hynix President Kim Joo-sun emphasized, “At this CES, we will showcase a wide range of representative AI memory products such as HBM and eSSD, as well as solutions optimized for on-device AI and next-generation AI memory,” and “Through this, we will widely publicize our technological competitiveness that is preparing for the future as a ‘full-stack AI memory provider.’”

SK Hynix will operate a joint exhibition hall with SK affiliates such as SK Telecom, SKC, and SK Enmove under the theme of ‘Creating a sustainable future with innovative AI technology (Innovative AI, Sustainable tomorrow)’. The exhibition hall is composed in the form of waves of light to show how SK Group’s AI infrastructure and services are changing the world.

SK Hynix, the world’s first company to mass-produce and supply 5th generation HBM (HBM3E) 12-layer products to customers, will present a sample of the HBM3E 16-layer product, which was officially developed in November of last year, at this exhibition. This product has implemented the industry’s highest 16-layer level by applying the Advanced MR-MUF process, while controlling chip warpage and maximizing heat dissipation performance.

In addition, we will also be exhibiting high-capacity, high-performance enterprise SSD (eSSD, enterprise SSD) products, the demand for which is rapidly increasing as the construction of AI data centers increases. This also includes the 122TB 'D5-P5336' product developed by subsidiary Solidigm in November of last year. This product is said to be receiving great attention from AI data center customers as it has the largest capacity to date as well as high power and space efficiency.

SK Hynix President Ahn Hyun said, “Following Solidime’s success in developing a QLC-based 61TB product last December, SK Hynix expects to maximize synergy based on a balanced portfolio between the two companies in the high-capacity eSSD market.”

SK Hynix will also exhibit products for on-device AI, such as 'LPCAMM2' and 'ZUFS 4.0', which improve data processing speed and power efficiency to implement AI in edge devices such as PCs and smartphones. It will also exhibit CXL and PIM, which will be positioned as core infrastructure for next-generation data centers, as well as CMM-Ax and AiMX, which are modularized versions of each.

In particular, CMM-Ax is a groundbreaking product that can contribute to improving the performance and energy efficiency of next-generation server platforms by adding computational functions to the advantages of CXL, which can expand high-capacity memory.

SK hynix CEO Kwak No-jeong said, “The changes in the world triggered by AI are expected to accelerate further this year, and our company will lead the customized HBM market that meets the diverse needs of customers by mass producing the 6th generation HBM (HBM4) in the second half of this year.” He added, “SK hynix will continue to do its best to suggest new possibilities in the AI era based on technological innovation and provide irreplaceable value to customers.”