SK Hynix showcased memory innovation that will lead AI technology by unveiling the HBM4 12-layer model to be released in the second half of this year through 'GTC 2025'.

SK Hynix participated in the global AI conference 'GTC 2025' hosted by NVIDIA in San Jose, California, USA from March 17 to 21 and unveiled its leading memory technology.

In this exhibition themed ‘Memory, AI and the Power to Lead Tomorrow’, the company presented various memory solutions for the AI era and suggested new possibilities for the AI industry.

In particular, SK Hynix exhibited memory products covering AI data centers, on-devices, and automotive fields.

On-device technology is a key technology that enhances response speed and user-tailored AI functions by performing calculations on the device itself without a physical server, and memory products utilizing this are attracting attention.

The company also further solidified its position as an industry leader by unveiling the world's first mass-produced 5th generation HBM (HBM3E) 12-layer product, as well as a new AI server memory standard, SOCAMM.

A model of the HBM4 12-stage product was also included in this exhibition. The goal is to mass produce within the year.

SK Hynix's key executives, including CEO Kwak No-jeong, President Kim Joo-sun, and Vice President Lee Sang-rak, attended this event to strengthen cooperation with global AI industry leaders.

CEO Kim Joo-sun said, “We are delighted to present our differentiated AI memory technology through this GTC,” and expressed his ambition, saying, “Based on our competitiveness in the AI memory field, we will leap forward as a ‘full-stack AI memory provider.’”