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Applied Materials Targets 'Memory Wall' in AI Era...Presents Solutions Across D-RAM, HBM, and Packaging
In the artificial intelligence (AI) era, semiconductor industry competition hinges on 'data movement' rather than 'computation'. As AI models grow lar..
2026.08.31 by 배종인 기자
Anyfive merges with Wizdomain and TechDNA...Launching AI-based IP and R&D platform
Anyfive, a specialized IP integrated management company, has completed a merger with Wizdomain and TechDNA and launched an AI-based IP and R&D integra..
2026.08.31 by 배종인 기자
Semiconductor investment momentum shifts from front-end to back-end
The flow of semiconductor investment is shifting from front-end to back-end and packaging-focused processes. Global companies are concentrating on HBM..
2026.08.28 by 배종인 기자
Snowflake Presents Data Platform Roadmap for Agentic AI Era
Snowflake emphasized at the Seoul roundtable that the key to enterprise AI proliferation lies in "Agentic AI" and the integration of data and workflow..
2026.08.28 by 배종인 기자
A single misaligned light means 'defect'… Vehicle interior lighting now guarded by semiconductors and software
Automotive interior lighting is moving beyond its role as 'auxiliary lighting.' As it becomes a core element of user experience (UX) that expresses br..
2026.08.28 by 명세환 기자
AI Agents Trigger 'Memory Supercycle'
At the 'Dell Technologies Forum 2026', SK Hynix Vice President Joo Young-pyo emphasized that as AI proliferation advances, memory bandwidth and effici..
2026.08.28 by 배종인 기자
ST Microelectronics and NUS Establish Joint Research Center 'HELIX' for Edge AI
ST Microelectronics and the National University of Singapore have established the 'HELIX' joint research center aimed at implementing embedded AI in e..
2026.08.28 by 배종인 기자
Sang-Mo Yu, Dell President: "AI Is Now Infrastructure—Integrated Approach to Security, Power, and Data Centers Is Essential"
At Dell Technologies Forum 2026, Sang-Mo Yu, President of Dell Technologies Korea, emphasized that AI has transcended the role of a productivity tool ..
2026.08.28 by 배종인 기자
SK Hynix Breaks Ground on U.S. Indiana HBM Production Base...Mass Production of 'Made in USA' HBM in 2029
SK Hynix announced that it held a groundbreaking ceremony on the 27th (local time) for an advanced packaging production facility for AI memory in West..
2026.08.28 by 배종인 기자
Lam Research Breaks Ground on New R&D Facility in Oregon
Lam Research held a groundbreaking ceremony for a new R&D center at its Tualatin campus in Oregon to respond to growing demand for AI semiconductor de..
2026.08.28 by 배종인 기자
Keysight Technologies Launches Electronic Design Verification Solution 'Keysight Multiphysics'
Keysight Technologies has launched 'Keysight Multiphysics', a design verification solution that analyzes interactions between multiple physical elemen..
2026.08.27 by 배종인 기자
ETRI Unveils AI Vision and AIDC Strategy at 50th Anniversary Conference
The Electronics and Telecommunications Research Institute (ETRI) will hold 'ETRI Conference 2026' in Seoul on September 1st to commemorate its 50th an..
2026.08.26 by 명세환 기자