At the 'Dell Technologies Forum 2026', SK Hynix Vice President Joo Young-pyo emphasized that as AI proliferation advances, memory bandwidth and efficiency emerge as critical bottlenecks, and SK Hynix must address this through HBM, 3D packaging, PIM, CXL, and memory pooling. As generative and inference-type AI increase, TB-level memory capacity, high-speed bandwidth, and sophisticated data processing have become essential, and a transition from GPU-centric architecture to memory-centric architecture is underway. HBM demand is surging rapidly, with memory efficiency, computational optimization, and system integration identified as key competitiveness factors for AI.