Communications / Networking

Schneider Electric Presents 800V DC Architecture for AI Data Centers

Schneider Electric is collaborating with NVIDIA to develop an 800V DC architecture to address ultra-high power density challenges in AI data centers. ..

2026.08.05 by 명세환 기자

SK Hynix and SanDisk Unveil First HBF Standard Specification…Presenting AI Memory Strategy at FMS 2026

SK Hynix and SanDisk have unveiled the first standard specification for HBF (High Bandwidth Flash). Finalized within six months, this specification su..

2026.08.05 by 배종인 기자

Kaspersky KCS, DevSecOps Optimization·GitHub Actions Error Detection Enhanced

Kaspersky has released a new version of its container security solution KCS. The update adds features including GitHub Actions configuration error det..

2026.08.05 by 명세환 기자

Gartner: “AI Inference Will Be the Main Cause of Privacy Breaches in 2029”

Gartner has warned that the primary cause of personal data breaches will shift from data exfiltration to AI-based inference by 2029. AI inference atta..

2026.08.03 by 명세환 기자

Cloudera Named Leader in 'Data Lakehouse' Category of Forrester Wave

Cloudera has been selected as a Leader in Forrester's Q3 2026 evaluation of the data lakehouse segment. The company was recognized for its capabilitie..

2026.08.03 by 명세환 기자

Theori Supplies AI Penetration Testing 'Xint Web' to Woori Financial Group

Theoria's AI-based penetration testing solution 'Xint Web' has been deployed at Woori Financial Group. Using autonomous black-box penetration testing ..

2026.08.03 by 명세환 기자

Korea Radio Promotion Association and KT Expand Scope of Terminal Specification Verification (SAT) from 5G to LTE

The Korea Radio Promotion Association (Chairman Hong Beom-sik, hereinafter 'RAPA') and KT (CEO Park Yun-young) will expand the support scope of the 5G..

2026.08.03 by 배종인 기자

The Era of 1 Million GPUs: Bottlenecks Are 'Wiring,' Not Computation… CPOs Are Changing the Data Center Landscape

AI data centers face data movement as a bottleneck rather than GPU computation. CPO (Co-Packaged Optics), which packages switch ASICs and optical engi..

2026.07.31 by 배종인 기자

DeepX, KT, and Cesol Join Hands for NPU-Based On-Device AIoT Business

DeepX is collaborating with KT and Sesol to co-develop an AI Edge Box equipped with the ultra-low-power NPU chip DX-M1. As an on-device AI solution th..

2026.07.31 by 배종인 기자

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