The Problem with AI is Not Performa..
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Semiconductor investment momentum shifts from front-end to back-end
The flow of semiconductor investment is shifting from front-end to back-end and packaging-focused processes. Global companies are concentrating on HBM..
2026.08.28 by 배종인 기자
The Problem with AI is Not Performance, but Trust
CEO Kang Min-seung emphasized at Snowflake's World Tour Seoul that generative AI has entered a phase where "trust" rather than accuracy becomes the ke..
2026.08.28 by 배종인 기자
Snowflake Presents Data Platform Roadmap for Agentic AI Era
Snowflake emphasized at the Seoul roundtable that the key to enterprise AI proliferation lies in "Agentic AI" and the integration of data and workflow..
2026.08.28 by 배종인 기자
A single misaligned light means 'defect'… Vehicle interior lighting now guarded by semiconductors and software
자동차 실내조명이 '보조 조명'의 자리를 벗어나고 있다. 색상과 애니메이션으로 브랜드 아이덴티티를 드러내고 운전자 취향을 담아내는 사용자 경험(UX)의 핵심 요소로 올라서면서, LED 실내 앰비언트 시장도 빠르게 커지는 중이다. 이에 관하여 '미래 자동차를 밝히는 지능..
2026.08.28 by 명세환 기자
“AI 에이전트, ‘메모리 슈퍼사이클’ 촉발”
‘델 테크놀로지스 포럼 2026’에서 SK하이닉스 주영표 부사장은 AI 확산으로 메모리 대역폭과 효율이 핵심 병목으로 떠오르며, SK하이닉스는 HBM·3D 패키징·PIM·CXL·메모리 풀링 등으로 이를 해결해야 한다고 강조했다. 생성형·추론형 AI가 늘며 TB급 메모리..
2026.08.28 by 배종인 기자
ST Microelectronics and NUS Establish Joint Research Center 'HELIX' for Edge AI
ST Microelectronics and the National University of Singapore have established the 'HELIX' joint research center aimed at implementing embedded AI in e..
2026.08.28 by 배종인 기자
Sang-Mo Yu, Dell President: "AI Is Now Infrastructure—Integrated Approach to Security, Power, and Data Centers Is Essential"
At Dell Technologies Forum 2026, Sang-Mo Yu, President of Dell Technologies Korea, emphasized that AI has transcended the role of a productivity tool ..
2026.08.28 by 배종인 기자
Ecolab and K-water Discuss Innovation Collaboration in Advanced Industry Water Management
Ecolab and the Korea Water Resources Corporation jointly discussed cooperation directions for maximizing water use efficiency in advanced industries s..
2026.08.28 by 명세환 기자
SK Hynix Breaks Ground on U.S. Indiana HBM Production Base...Mass Production of 'Made in USA' HBM in 2029
SK Hynix announced that it held a groundbreaking ceremony on the 27th (local time) for an advanced packaging production facility for AI memory in West..
2026.08.28 by 배종인 기자