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Seorin C&I Launches Leadtek RTX PRO Blackwell Graphics Cards in Korea
Seourin C&I has launched three types of Leadtek's NVIDIA Blackwell-based graphics cards for workstations in the domestic market. The new products are ..
2026.05.27 by 명세환 기자
SEMI, “Glass Core Substrate Market Growing at 67.2% Annual Rate”
SEMI has jointly published a report on the glass core substrate market and development trends with GNC. The report analyzes that as demand for advance..
2026.05.27 by 배종인 기자
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ST Launches 700V GaN Power Semiconductor… Targeting Power Efficiency for AI Servers and Robotics
STMicroelectronics has launched 700V-class PowerGaN power semiconductors applicable to AI servers, robotics, industrial power supplies, smart grids, a..
2026.05.27 by 명세환 기자
Schneider Electric Hosts 'Innovation Day' for Semiconductor Industry
Schneider Electric Korea is hosting an "Innovation Day" event for the semiconductor industry and equipment manufacturers. The event has been organized..
2026.05.26 by 배종인 기자
Lam Research Establishes Salzburg Panel Innovation Center… Aims to Transition to Mass Production of AI Packaging
Lam Research has established a Panel Innovation Center in Salzburg, Austria. The facility is an R&D center built on panel-level wet process technology..
2026.05.26 by 배종인 기자
Synology Launches Enterprise NVMe Storage 'PAS7700'
Synology has launched the 'PAS7700', its first active-active all-flash NVMe enterprise storage system. The PAS7700 targets AI, virtualization, and lar..
2026.05.26 by 명세환 기자
DeepX Unveils Physical AI Ecosystem with Over 30 Partners at Computex
DeepX will unveil physical AI solutions with approximately 30 global partners at Computex Taipei 2026. Since winning the InnoVEX Innovation Award in 2..
2026.05.26 by 배종인 기자
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Mouser Expands Supply of Schneider Industrial Solutions
Global electronic components distributor Mouser is strengthening its strategy to capture the industrial automation and energy management markets by ex..
2026.05.26 by 배종인 기자
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SK Hynix Unveils HBM Internal Cooling Technology… AI Response to Memory Heat
SK Hynix has unveiled 'iHBM' technology, which incorporates cooling elements inside the HBM package. This technology forms a separate heat dissipation..
2026.05.26 by 배종인 기자