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Mobilint and Intops Collaborate on AI Manufacturing… Combining Semiconductor Design and Production Infrastructure
AI semiconductor company Mobilint and electronics manufacturing services company Intaps have signed a business agreement for AI solution manufacturing..
2026.03.19 by 명세환 기자
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Next-generation magnetic sensors, Hall effect technology, are changing the game.
Smart door locks, notebooks, wireless earphones, and water/gas meters. Various electronic devices in our daily lives rely on invisible 'magnetic senso..
2026.03.19 by 배종인 기자
Synopsys Unveils AI Design Automation Achievements with NVIDIA at GTC 2026
Siemens Simcenter revealed engineering achievements combining AI and high-performance computing at NVIDIA GTC 2026. The approach integrates semiconduc..
2026.03.19 by 배종인 기자
Mythic Sets Out to Develop Ultra-Low Power AI Semiconductors Using SST MemBrain Technology
Mythic has adopted Silicon Storage Technology (SST)'s memBrain technology in the development of its next-generation Analog Processing Unit (APU). This..
2026.03.19 by 명세환 기자
Samsung Electronics and AMD Join Forces on HBM4 and Foundry Services
Samsung Electronics and AMD are significantly expanding their cooperation to strengthen next-generation artificial intelligence (AI) infrastructure co..
2026.03.18 by 배종인 기자
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Intel Unveils Next-Generation High-Performance Laptop CPU 'Core Ultra 200HX Plus'
Intel has officially announced the "Intel Core Ultra 200HX Plus" series, a new mobile processor lineup targeting the high-performance notebook market,..
2026.03.18 by 배종인 기자
SK Hynix: “Autonomous Fabs Are the Solution for Manufacturing Innovation in the AI Era”
At the NVIDIA GTC 2026 panel session "Building the Future of Manufacturing" held on the 17th local time in the United States, Do Seung-yong, Vice Pres..
2026.03.18 by 배종인 기자
ST Launches GaN Power IC 'MasterGaN6'... Targeting Chargers, Lighting, and Solar Power
ST Microelectronics has launched the MasterGaN6, a second-generation MasterGaN half-bridge power IC. The product is characterized by integrating a GaN..
2026.03.18 by 배종인 기자
TI and Nvidia Unveil 800VDC Power Architecture… AI Data Center Power Transition Begins in Earnest
Texas Instruments (TI) has unveiled a next-generation 800VDC power architecture for AI data centers in collaboration with Nvidia. This architecture is..
2026.03.18 by 명세환 기자