State-of-the-art 3D packaging technology mass production semiconductor production facility
Intel has opened a semiconductor manufacturing facility capable of mass producing cutting-edge 3D packaging technology.
Intel announced on the 25th that it has opened a state-of-the-art semiconductor production facility, 'Fab 9', in Rio Rancho, New Mexico, USA.
This is part of Intel's $3.5 billion investment in advanced semiconductor packaging manufacturing facilities, including Foveros, Intel's innovative 3D packaging technology that allows different chips to be flexibly combined to optimize power, performance and price at its New Mexico facility.
“We celebrate the opening of the only U.S. manufacturing facility capable of producing the world’s most advanced packaging solutions at scale,” said Keyvan Esfarjani, Intel senior vice president and global chief operating officer. “This cutting-edge technology will allow Intel to provide customers with tangible benefits in performance, form factor and design flexibility, all within a resilient supply chain.” “We would like to thank our Intel employees, partners, and collaborators who have continuously pushed the boundaries of packaging innovation,” he said.
Intel's global factory network provides a competitive advantage in product optimization, economies of scale, and a flexible supply chain.
Fab 9 and Fab 11x facilities in New Mexico are the first manufacturing facilities capable of high-volume production of Intel’s 3D advanced packaging technology.
It is also Intel's first large-scale advanced packaging site with end-to-end manufacturing processes in a common location, streamlining the supply chain from order to final product.
Fab 9 will accelerate Intel’s next-generation innovations in advanced packaging technologies. As the semiconductor industry transitions to a heterogeneous era with multiple “chiplets” in a single package, advanced packaging technologies like Foveros and EMIB (embedded multi-die interconnect bridge) will provide a fast, cost-effective way to reach the trillion-transistor mark and continue Moore’s Law beyond 2030.
Intel's advanced 3D packaging technology, Foveros, is the first solution to build processors by stacking compute tiles vertically rather than horizontally.
Additionally, Intel and foundry customers can mix and match compute tiles to optimize cost and power efficiency.