텍사스 인스트루먼트(Texas Instruments, TI)는 새로운 전력관리 칩인 TPS1685를 소개했다. TPS1685는 업계 최초의 48볼트 통합 핫스왑 eFuse 솔루션으로, 전력 관리와 보호를 위한 혁신적인 기술을 제공한다.
48V Hot Swap eFuse Simplifies Data Center Design and 6kW Power
Realizing reduced size through integrated stacked design and current monitoring solutions
“The TPS1685 is the industry’s first 48-volt integrated hot-swap eFuse capable of reaching power levels in excess of 6 kW without the need for separate sense resistors or current amplifiers, providing a breakthrough technology for power management and protection in modern data centers.”
Texas Instruments (TI) held an online press conference on the 27th and introduced a new power management chip, the TPS1685.
The presentation was led by Priank Kacker, Product Marketing Manager.
Priank Kacker recently mentioned that data centers are becoming increasingly important with the advancement of artificial intelligence (AI) and high-performance computing (HPC), and that these data centers consume enormous amounts of power, making efficient and stable power management essential.
Additionally, to address these power trends, the company launched the TPS1685, the industry's first 48-volt integrated hot-swap eFuse solution that provides innovative technology for power management and protection.
The product supports an input voltage range of 9 V to 80 V and has a stacked design that can handle a current of 20 A, providing designers with flexibility and expandability.
Especially TPSThe 1685 integrates a current monitoring function, eliminating the need for a separate sense resistor or current amplifier, simplifying the design and reducing the solution size.
According to Priank Kacker, the introduction of TPS1685 in data centers brings several benefits.
First of all, this product has high power density and the ability to stably manage power of 6㎾ or more. This maximizes space efficiency in data centers and helps meet the power demands of high-performance computing and AI applications.
Additionally, the TPS1685 provides various protection features such as overcurrent protection, temperature protection, and power path protection to enhance the stability and reliability of data centers.
In addition, this product supports parallel connection, allowing flexible use even in high-power systems.
These advantages provide cost-saving opportunities for power developers.
Unlike conventional complex power management systems, the TPS1685 is an integrated solution that reduces the number of components and simplifies the design process, saving development costs and time.
These features expand the usability of the TPS1685 in a variety of high-power applications, including not only data centers but also network cards, graphics cards, and servers.
Along with the TPS1685, TI also introduced a new family of integrated GaN power stages.
The LMG3650R035, LMG3650R025, and LMG3650R070 are available in an industry-standard TOLL package, enabling engineers to easily leverage the efficiencies of TI GaN without the need for costly and time-consuming redesign.
The new GaN power family integrates high-performance gate drivers with 650 V GaN field-effect transistors (FETs) to achieve high efficiency (>98%) and high power density (>100 W/in), along with advanced protection features such as overcurrent protection, short-circuit protection, and over-temperature protection.
This is especially important for AC/DC applications such as server power that require more power in a smaller space.
Priank Kacker said, “TI will be announcing the TPS1685 and the new GaN power family on TI.com.“We are providing chips and evaluation modules so that prenatal care can be applied to development,” he concluded, adding, “The newly released products provide both efficiency and stability, and we expect them to bring about significant innovation in future new data center power designs.”