텍사스 인스트루먼트(TI)가 에지 AI를 내장한 AWRL6844 60GHz 밀리미터파 레이더 센서를 출시하며, 안전벨트 알림 시스템, 어린이 탑승 감지 및 침입 감지와 같은 기능을 지원해 더 안전한 주행 환경을 제공한다고 밝혔다. 또한 TI의 차세대 오디오 DSP 코어를 탑재한 AM275x-Q1 MCU와 AM62D-Q1 프로세서도 출시하며, 프리미엄 오디오 기능을 더욱 합리적인 가격으로 제공한다고 전했다.
AWRL6844, Replaces Multiple Sensors and Improves Vehicle Interior Sensing Capabilities
AM275x-Q1·AM62D-Q1, Immersive In-Car Experience
“A new single-chip radar sensor with built-in edge AI can replace three or more existing sensors at once. These advantages reduce development costs and allow automakers to improve the system regardless of the car’s price.”
Texas Instruments (TI) held an online media conference on the 17th and introduced a single chip that integrates TI's new edge AI-based radar sensor and automotive audio processor.
The presentation was led by Kevin Ortiz, TI Radar Product Marketing Engineer, and Sutton Dole, TI Signal Processing MCU Product Marketing Engineer.
Kevin Ortiz said that recent automotive consumer trends show a demand for a comfortable and immersive in-car experience while getting from point A to point B, and while in the past developers had to add more audio components to cars to meet this demand, they are now able to do more without adding new components or complexity.
The reason for this is that they are introducing edge AI technology for automobiles using new digital signal processing and NPU, or neural processing unit.
Kevin Ortiz said TI is providing automotive developers with the devices they need to create innovative products, along with the software models they need to do so, helping them build on TI’s technology to unlock new possibilities for innovation.
The product for this is the AWRL6844 60GHz millimeter wave radar sensor, which is a single chip that runs edge AI algorithms and supports functions such as seat belt reminder system, child occupant detection, and intrusion detection, providing a safer driving environment.
Additionally, the AM275x-Q1 MCU and AM62D-Q1 processor, which feature TI's next-generation audio DSP core, are said to offer premium audio features at a more reasonable price.r />
In particular, it can be combined with TI's latest analog products, including the TAS6754-Q1 Class-D audio amplifier, to form a complete audio amplifier system.
Kevin Ortiz said these products can help improve a car’s systems, making for a safer, more immersive driving experience, and they’re especially great because they’re available regardless of the vehicle’s price.
The Edge AI-based AWRL6844 60GHz millimeter-wave radar sensor integrates three in-vehicle sensing capabilities, replacing multiple sensor technologies such as seat weight mats and ultrasonic sensors, and reducing total implementation costs by an average of $20 per vehicle.
In particular, the AWL6844 integrates four transmitters and four receivers to provide high-resolution sensing data at an optimized cost for automotive manufacturers.
This data is fed to custom on-chip hardware accelerators and DSPs that run application-specific AI-based algorithms, improving decision-making accuracy and reducing processing times.
The edge intelligence capabilities of the AWL6844 sensor help improve the driving experience, supporting occupant detection and location during driving with 98% accuracy, enabling the seat belt reminder function. It also detects micro-movements inside the vehicle in real time after parking, monitoring whether children are left unattended in the vehicle with over 90% accuracy. Among the runners, it adapts to various environments and reduces false intrusion detection alarms caused by vehicle shaking or external movement.
Sutton Doll then introduced TI's audio portfolio that can implement premium car audio.
TI's AM275x-Q1 MCUs and AM62D-Q1 processors integrate TI's vector-based C7x DSP cores, Arm cores, memory, audio networking and hardware security modules into a single SoC, reducing the number of components required for automotive audio amplifier systems.
The C7x cores are combined with a matrix multiply accelerator to form a neural processing unit (NPU) capable of handling both traditional and edge AI-based audio algorithms.
These automotive audio SoCs are scalable, able to meet memory and performance requirements from entry-level to high-end systems with minimal design changes and cost investment.
Additionally, TI’s next-generation C7x DSP core delivers more than four times the processing performance of other audio DSPs, enabling audio engineers to manage multiple functions within a single core.
The AM275x-Q1 MCU and AM62D-Q1 processor enable immersive in-cabin audio experiences with features such as spatial audio, active noise cancellation, sound synthesis, and advanced vehicle networking via Audio Video Bridging (AVB) over Ethernet.
“These new devices from TI help engineers reduce the number of components they need to use, and make it easier and more cost-effective to build products,” said Sutton Doll. “OEMs who use these products will be able to build superior premium audio systems into a variety of vehicle models.” />
“The impact of semiconductor innovation on automotive systems is truly profound, and TI’s expanding portfolio builds on decades of automotive expertise to help engineers create new vehicles,” he said.